EP2AGX125EF29I5N

The EP2AGX125EF29I5N is an Arria II GX field programmable gate array (FPGA) offering high-density programmable logic and significant on-chip memory in a 780-ball FCBGA package. It provides a balance of logic capacity, embedded RAM, and I/O count intended for designs that require compact, reconfigurable hardware in an industrial temperature range.

Key Features

• Logic Capacity — Provides 118,143 logic elements suitable for complex programmable logic implementations.
• Embedded Memory — Approximately 8.3 Mbits of on-chip RAM for buffering, packet storage, or local data structures.
• I/O Density — 372 user I/O pins to support diverse peripheral and interface requirements.
• Package & Mounting — 780-BBGA / 780-FBGA (29×29) surface-mount package for high-density board integration.
• Power Supply Range — Core supply voltage specified from 870 mV to 930 mV to match system power rails and regulator designs.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C, supporting deployment in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density programmable logic — Implement complex state machines, custom datapaths, and glue logic where large logic capacity and embedded RAM are required.
• Interface aggregation — Consolidate multiple I/O streams using the device’s 372 I/Os to simplify board-level connectivity.
• Industrial control and automation — Use the industrial temperature range and robust package for deployed control systems requiring reconfigurable logic.

Unique Advantages

• Substantial logic resources: 118,143 logic elements enable implementation of large logic designs in a single FPGA, reducing the need for multiple devices.
• On-chip memory for buffering: Approximately 8.3 Mbits of embedded RAM supports local storage for data paths and temporary buffering without external memory.
• High I/O count: 372 I/Os allow direct connection to a broad set of peripherals and interfaces, minimizing external multiplexing or I/O expanders.
• Industrial-rated operation: Specified −40°C to 100°C operating range allows use in a wide range of environmental conditions.
• Compact, high-density package: 780-FBGA (29×29) surface-mount package provides a small footprint for space-constrained designs.
• Regulated core voltage: Narrow core supply range (870 mV–930 mV) simplifies power budgeting and regulator selection for consistent device operation.

Why Choose EP2AGX125EF29I5N?

EP2AGX125EF29I5N delivers a combination of high logic density, multiple megabits of embedded RAM, and a large I/O count in a compact 780-FBGA package, all rated for industrial temperature operation. It is well suited to projects that require substantial on-chip resources in a single FPGA footprint, enabling smaller board area and simplified system architecture.

Designers looking to consolidate complex logic functions, implement on-chip buffering, and support numerous external interfaces will find the device’s specification set aligned with robust, reconfigurable hardware requirements.

Request a quote or submit an inquiry for EP2AGX125EF29I5N to receive pricing and availability information for your design and procurement needs.