EP2AGX125EF35C4G

The EP2AGX125EF35C4G is an Intel Arria II GX field programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package. It provides a large logic capacity and substantial on-chip memory for commercial-grade configurable logic implementations.

With 452 I/O pins, support for a nominal supply range of 870 mV to 930 mV, and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require high logic density, flexible I/O connectivity, and surface-mount packaging.

Key Features

• FPGA Core  Arria II GX field programmable gate array offering a high-capacity programmable fabric for custom logic implementations.
• Logic Capacity  Approximately 118,143 logic elements to implement complex digital functions and custom state machines.
• Embedded Memory  Approximately 8.32 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive logic functions.
• I/O Resources  452 available I/O pins to support extensive peripheral and system interfacing requirements.
• Power Supply  Operates from a supply range of 870 mV to 930 mV, enabling predictable power design within the specified window.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface mount device for PCB assembly.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulated material requirements in commercial products.

Typical Applications

• Commercial Embedded Systems  Used to implement custom, reprogrammable logic in commercial electronic products requiring substantial logic and on-chip memory.
• High-Density I/O Control  Supports designs that need broad external connectivity with its 452 I/O pins for interfacing sensors, peripherals, and supporting circuitry.
• Custom Hardware Acceleration  Provides programmable resources and embedded RAM capacity useful for offloading compute or buffering tasks within a commercial system design.

Unique Advantages

• Significant logic capacity: Approximately 118,143 logic elements enable implementation of complex digital functions without external ASICs.
• Substantial embedded memory: Approximately 8.32 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• Extensive I/O: 452 I/O pins allow flexible system-level interfacing and the ability to connect numerous peripherals directly.
• Compact surface-mount package: 1152-BBGA (1152-FBGA, 35×35) form factor supports high-density PCB layouts while maintaining large resource counts.
• Commercial temperature rating: 0 °C to 85 °C suitability aligns the device with a wide range of commercial electronic products.
• RoHS compliance: Meets material compliance requirements for many commercial manufacturing programs.

Why Choose EP2AGX125EF35C4G?

The EP2AGX125EF35C4G delivers a balance of high logic density, on-chip memory, and extensive I/O in a surface-mount 1152-BBGA package, positioning it for demanding commercial applications that require configurable hardware. Its specified supply voltage range and commercial operating temperature make it suitable for production systems within standard commercial environments.

Designed and manufactured by Intel, this Arria II GX FPGA offers designers a scalable, reprogrammable platform for embedding custom digital functions, consolidating multiple logic components, and reducing system complexity in commercial designs.

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