EP2AGX125EF35C5G

The EP2AGX125EF35C5G is an Intel Arria II GX Field Programmable Gate Array supplied in a 1152-FBGA (35×35) package. It integrates a large logic fabric, ample embedded memory, and a high pin count to support complex, I/O‑rich designs. This commercial‑grade FPGA is suited for applications that require significant programmable logic capacity and flexible I/O connectivity within a surface‑mount BGA package.

Key Features

• Logic Capacity — Provides 118,143 logic elements to implement extensive custom logic, state machines, and datapath functions.
• Logic Array Blocks (LABs) — Contains 4,964 logic array blocks (LABs) for structured logic organization and resource partitioning.
• Embedded Memory — Approximately 8.32 Mbits of on‑chip RAM for buffering, lookup tables, and small on‑chip data stores.
• I/O Count — 452 user I/Os to support multiple peripheral interfaces, parallel buses, and high‑pin‑count system connections.
• Power Supply Range — Core supply requirement between 870 mV and 930 mV, enabling precise power budgeting for system design.
• Package & Mounting — 1152-BBGA / FCBGA with supplier device package listed as 1152‑FBGA (35×35); designed for surface‑mount assembly.
• Operating Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High‑density digital logic — Implement custom processors, protocol bridges, and complex state machines using the FPGA’s large logic element count and LAB structure.
• Data buffering and packet processing — Use the on‑chip RAM to implement packet queues, FIFOs, and buffering for streaming data paths.
• I/O‑intensive interfaces — Leverage 452 I/Os to connect multiple peripherals, parallel data buses, or external memory interfaces in embedded systems.

Unique Advantages

• Substantial logic resources: 118,143 logic elements enable implementation of sizable custom logic and complex algorithms without immediate need for additional devices.
• Significant on‑chip memory: Approximately 8.32 Mbits of embedded RAM reduces reliance on external memory for moderate buffering and state storage.
• High I/O density: 452 I/Os simplify board routing for multi‑device systems and provide flexibility for diverse peripheral connections.
• Surface‑mount BGA packaging: 1152‑pin FBGA/BBGA package supports compact board layouts and standard SMT assembly processes.
• Commercial operating range: Rated 0 °C to 85 °C for mainstream embedded and industrially deployed commercial applications.
• Regulatory readiness: RoHS compliance supports environmental requirements for commercial product builds.

Why Choose EP2AGX125EF35C5G?

The EP2AGX125EF35C5G Arria II GX FPGA delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a 1152‑pin BGA package, making it appropriate for developers targeting complex, I/O‑heavy designs in commercial applications. Its commercial temperature rating and RoHS compliance align with standard manufacturing and deployment practices.

Designers and procurement teams seeking a programmable platform with substantial on‑chip resources and flexible I/O can use this device to consolidate functions, reduce BOM complexity, and accelerate time‑to‑market for mid‑to‑large scale FPGA implementations.

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