EP2AGX125EF35C6G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 452 8315904 118143 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,483 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 452 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4964 | Number of Logic Elements/Cells | 118143 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8315904 |
Overview of EP2AGX125EF35C6G – Arria II GX FPGA, 118,143 Logic Elements, 1152-FBGA
The EP2AGX125EF35C6G is an Intel Arria II GX Field Programmable Gate Array supplied in a 1152‑FBGA (35×35) surface-mount package for commercial applications. It integrates a 40‑nm low-power FPGA engine with a large fabric of 118,143 logic elements and approximately 8.3 Mbits of embedded memory to support complex logic, memory buffering and DSP tasks.
Designed for system designs that require high integration and configurable I/O, this device addresses use cases such as high-bandwidth interfaces, protocol bridging, and DSP acceleration while operating from a low supply range (870 mV–930 mV) within a commercial temperature range (0 °C–85 °C).
Key Features
- Logic Capacity 118,143 logic elements provide substantial programmable fabric for implementing complex state machines, packet processing, and custom compute pipelines.
- Embedded Memory Approximately 8.3 Mbits of on-chip RAM for FIFOs, buffering, and local data storage to support high-throughput designs.
- DSP and Arithmetic Support Arria II family DSP features (as documented for the device family) include high-performance DSP blocks and configurable multiplier options suitable for signal processing workloads.
- High‑speed Transceiver Capability (family-level) The Arria II family supports up to 24 full-duplex transceivers at rates between 600 Mbps and 6.375 Gbps, enabling multi‑Gbps serial links for common serial protocols.
- I/O Density 452 I/O pins available for flexible interfacing to external memory, peripherals, and high-speed SERDES lanes.
- Package & Mounting 1152‑BBGA / FCBGA (supplier package: 1152‑FBGA, 35×35); surface-mount for PCB assembly in space-constrained designs.
- Power & Supply Low-voltage operation across a supply range of 870 mV to 930 mV, enabling compatibility with modern low-voltage power architectures.
- Commercial Temperature Grade Specified for 0 °C to 85 °C operation to meet typical commercial electronics requirements.
- Standards & Compliance RoHS compliant, supporting lead‑free manufacturing processes.
Typical Applications
- High‑Speed Networking Implement packet processing, protocol offload and bridging functions that leverage the device’s large logic fabric and family-level multi‑Gbps transceiver support.
- PCIe and System Interfaces Use in systems requiring configurable PHY/MAC and interface integration thanks to Arria II family support for common physical interfaces and protocol IP.
- Digital Signal Processing Accelerate DSP workloads with the family’s dedicated DSP resources and on-chip memory for buffering and intermediate storage.
- Broadcast and Serial Video Suitable for designs that handle SD/HD/3G/ASI serial interfaces and other high-rate serial data flows referenced in the Arria II device documentation.
Unique Advantages
- Substantial Logic Capacity: 118,143 logic elements provide headroom for complex logic partitioning and system integration without immediate need for external logic devices.
- Significant On‑Chip Memory: Approximately 8.3 Mbits of embedded RAM reduces external memory dependence for many buffering and FIFO requirements.
- Flexible I/O Count: 452 I/Os enable broad peripheral and bus connectivity options while supporting mixed-signal front ends through configurable I/O banks.
- Low‑Voltage Operation: Narrow supply range (870 mV–930 mV) suits power-optimized system architectures and modern low-voltage domains.
- Commercial‑grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to support standard commercial products and manufacturing flows.
Why Choose EP2AGX125EF35C6G?
The EP2AGX125EF35C6G combines a large programmable fabric, multi-megabit embedded memory, and extensive I/O in a compact 1152‑FBGA package to enable integrated, high-performance FPGA designs for commercial applications. Its Arria II GX family features—documented for transceiver capability, DSP resources, and interface support—make it suitable for developers implementing high-bandwidth interfaces, protocol engines, and DSP-accelerated systems.
This device is appropriate for teams and projects that require a scalable FPGA solution with a balance of logic density, embedded memory, and configurable connectivity while adhering to commercial temperature and RoHS manufacturing requirements.
Request a quote or submit an RFQ to check availability and lead times for the EP2AGX125EF35C6G and explore how it fits your next design.

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