EP2AGX125EF35I3N

The EP2AGX125EF35I3N is an Arria II GX Field Programmable Gate Array (FPGA) IC provided in a 1152‑ball FCBGA package. It delivers a combination of high logic element capacity, embedded memory, and extensive I/O in a compact surface‑mount package.

This device is suited for designs that require substantial programmable logic and on‑chip RAM while operating across an industrial temperature range; it is offered in the industrial I3 speed grade as indicated by the part suffix.

Key Features

• High Logic Capacity — 118,143 logic elements to support complex programmable logic and custom datapath implementations.
• Embedded Memory — Approximately 8.3 Mbits of on‑chip RAM for buffering, FIFOs, and local storage close to logic.
• Extensive I/O — 452 I/O pins to enable broad board‑level interfacing and multiple parallel interfaces.
• Package and Mounting — 1152‑BBGA (FCBGA) surface‑mount package; supplier package specified as 1152‑FBGA (35×35 mm) for dense board integration.
• Industrial Grade and Speed — Part is specified as industrial grade with the I3 speed suffix, suitable for industrial applications.
• Wide Operating Temperature — Rated for −40 °C to 100 °C to support demanding thermal environments.
• Core Voltage Range — Core supply specified between 870 mV and 930 mV to match system power design requirements.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑density programmable logic — Implement complex state machines, datapaths, and custom accelerators that require ~118k logic elements and integrated RAM.
• Board‑level interface and protocol bridging — Use the 452 I/Os to connect multiple parallel interfaces, IO expansion, or custom I/O topologies.
• Industrial control systems — Industrial grade rating and −40 °C to 100 °C operating range make the device suitable for factory automation and control electronics.
• Compact system integration — 1152‑FBGA (35×35 mm) package enables dense mounting in space‑constrained PCB layouts.

Unique Advantages

• High programmable logic density: 118,143 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing external component count.
• Substantial on‑chip RAM: Approximately 8.3 Mbits of embedded memory supports local buffering and reduces dependency on external memory.
• Broad I/O availability: 452 I/Os enable flexible interfacing options for mixed‑signal front ends, control busses, and parallel data paths.
• Industrial operating range: Rated −40 °C to 100 °C and designated industrial grade for reliable operation in harsher environments.
• Compact, manufacturable package: 1152‑FBGA (35×35 mm) surface‑mount package supports high‑density PCB assembly and automated manufacturing.
• Tight core voltage specification: 870–930 mV core supply range allows precise power design and regulation for consistent device behavior.

Why Choose EP2AGX125EF35I3N?

The EP2AGX125EF35I3N positions itself as a high‑capacity Arria II GX FPGA option for engineers needing substantial logic resources, several megabits of embedded RAM, and a large I/O footprint in a single, manufacturable package. Its industrial grade and wide operating temperature range provide robustness for demanding environments, while the 1152‑ball FCBGA package supports compact system designs.

This device is well suited to teams consolidating multiple functions onto a single FPGA, implementing board‑level interfaces, or designing industrial control and embedded systems where logic density, on‑chip memory, I/O count, and thermal reliability are key selection criteria.

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