EP2AGX125EF35I5ES

The EP2AGX125EF35I5ES is an Arria II GX field programmable gate array (FPGA) provided in a 1152-ball FCBGA package (35 × 35 mm). It delivers a high logic element count together with substantial on‑chip embedded memory and a large I/O complement for complex programmable logic designs.

Designed for designs that require dense logic, ample embedded RAM, and industrial temperature operation, this device supports systems that integrate high I/O capacity and transceiver-capable architectures as described for the Arria II GX device family.

Key Features

• Logic Capacity  118,143 logic elements enabling complex digital designs and multi‑function implementations.
• Embedded Memory  Approximately 8.32 Mbits of on‑chip RAM (8,315,904 total RAM bits) to support buffering, frame storage, and local data processing.
• I/O Count  452 user I/Os to interface with multiple peripherals, high‑speed buses, and external devices.
• Package  1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature‑constrained environments.
• Core Voltage  Supports a core supply voltage range of 870 mV to 930 mV, matching low‑voltage core requirements.
• RoHS Compliant  Meets RoHS environmental requirements for lead‑free manufacturing.

Typical Applications

• High‑density digital processing  Use the large logic capacity and embedded RAM for custom signal processing, data manipulation, and protocol handling.
• High‑I/O system integration  Leverage 452 I/Os to connect multiple sensors, peripherals, and external interfaces on a single FPGA solution.
• Industrial control and automation  Industrial temperature rating and surface‑mount package make the device suitable for control systems and factory automation equipment.
• High‑speed interface designs  Arria II GX family device characteristics (transceiver and I/O timing features documented in the device handbook) support designs requiring advanced interface capabilities.

Unique Advantages

• High logic density: 118,143 logic elements provide the headroom for complex, multi‑module designs without immediate need to partition across devices.
• Substantial on‑chip RAM: Approximately 8.32 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Large I/O complement: 452 I/Os simplify board routing and reduce the need for external I/O expanders in multi‑interface systems.
• Industrial temperature operation: Specified −40 °C to 100 °C allows deployment in a wide range of environmental conditions.
• Industry-standard BGA package: 1152-ball FCBGA (35×35) supports dense PCB layouts and established assembly processes.
• Regulatory readiness: RoHS compliance supports lead‑free manufacturing and global environmental requirements.

Why Choose EP2AGX125EF35I5ES?

The EP2AGX125EF35I5ES positions itself as a capable Arria II GX FPGA for designs that demand a balance of logic resources, embedded memory, and high I/O count within an industrial temperature envelope. Its 1152-ball FCBGA package and core voltage range make it suitable for compact, power‑conscious FPGA implementations.

Engineers targeting complex protocol handling, high‑density digital processing, and industrial applications will find this device provides the building blocks required for scalable, board‑level FPGA solutions backed by the Arria II GX device family documentation.

Request a quote or submit an RFQ to begin procurement of EP2AGX125EF35I5ES and evaluate how this Arria II GX FPGA fits your next design.