EP2AGX125EF35I5N

The EP2AGX125EF35I5N is an Intel Arria II GX field-programmable gate array provided in a 1152-FBGA (35×35) surface-mount package. It is an industrial-grade device with specifications and electrical characteristics described in the Arria II Device Handbook.

The device combines a high logic density, substantial embedded memory, and extensive I/O capability, with device-level details (including transceiver performance, core and periphery characteristics, and I/O timing) documented in the Arria II device datasheet.

Key Features

• Logic Density  Provides 118,143 logic elements for implementing complex custom digital logic and system functions.
• Embedded Memory  Approximately 8.32 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data structures.
• I/O Capability  452 device I/O pins to support dense external interfacing and parallel/serial connectivity.
• Package & Mounting  1152-BBGA / FCBGA supplier package (1152-FBGA, 35×35) in a surface-mount form factor for compact system integration.
• Voltage Supply  Core supply operating range of 870 mV to 930 mV as specified for device operation.
• Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Industrial Grade  Specified as an industrial-grade Arria II GX device; Arria II GX devices are offered in industrial speed grades (including I3 and I5) per the device handbook.
• Standards & Compliance  RoHS compliant for regulatory and environmental considerations.
• Device Handbook Coverage  Datasheet coverage includes electrical characteristics, transceiver performance, core and periphery performance, and I/O timing details.

Typical Applications

• High-speed serial interfaces  Leverages documented transceiver and PCI Express (PCIe) block characteristics for systems requiring transceiver-based links.
• Embedded system integration  Large logic element count and on-chip RAM enable custom control, processing, and protocol implementation within a single device.
• I/O-intensive platforms  High pin count supports extensive sensor, peripheral, and parallel-interface connectivity in compact PCB designs.

Unique Advantages

• High logic capacity: 118,143 logic elements enable complex custom logic and algorithm implementation without immediate need for external ASICs.
• Substantial embedded memory: Approximately 8.32 Mbits of on-chip RAM reduces dependency on external memory for buffering and local data storage.
• Extensive I/O: 452 I/O pins simplify interfacing to multiple peripherals, sensors, and high-density connectors.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in thermally demanding installations.
• Compact, surface-mount package: 1152-FBGA (35×35) enables high-density PCB integration while maintaining manufacturability.
• Regulatory compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose EP2AGX125EF35I5N?

The EP2AGX125EF35I5N Arria II GX FPGA provides a balance of high logic density, significant on-chip memory, and broad I/O in a compact 1152-FBGA surface-mount package. Its industrial temperature rating and documented device-level electrical and transceiver characteristics make it suitable for designs that require durable, high-capacity programmable logic with extensive interface options.

This device is appropriate for engineering teams seeking scalable FPGA resources backed by Intel’s Arria II device documentation, offering clear electrical, switching, and I/O timing guidance for integration and system design.

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