EP2AGX190EF29C4N

The EP2AGX190EF29C4N is an Arria II GX Field Programmable Gate Array (FPGA) IC provided in a 780-FBGA (29×29) package. It delivers high logic capacity and substantial on-chip memory in a commercial-grade device.

With 181,165 logic elements, approximately 10.18 Mbits of embedded memory, and 372 I/O pins, this device is targeted at designs that require dense logic integration, significant embedded RAM, and a high I/O count within a compact surface-mount package.

Key Features

• Logic Capacity — 181,165 logic elements to support complex custom logic and large-scale integration.
• Embedded Memory — Approximately 10.18 Mbits of on-chip RAM for buffering, packet storage, and embedded data structures.
• I/O Density — 372 I/O pins for broad interfacing capability with peripherals, memory, and transceiver blocks.
• Packaging & Mounting — 780-FBGA (29×29) package in a surface-mount form factor for compact board-level integration.
• Power Supply — Core voltage supply specified from 870 mV to 930 mV, consistent with modern low-voltage FPGA core rails.
• Operating Conditions — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial-environment applications.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Deploy large custom logic functions and state machines using the extensive logic element count.
• Memory-intensive designs — Use the on-chip RAM for buffering, packet processing, and embedded data storage without relying solely on external memory.
• High I/O-count interfaces — Integrate multiple peripherals, parallel buses, and I/O-rich subsystems thanks to 372 available I/O pins.

Unique Advantages

• Substantial integration in a compact package: 181,165 logic elements and approximately 10.18 Mbits of embedded memory in a 780-FBGA package reduce board-level component count.
• High I/O capability: 372 I/O pins enable flexible interfacing across multiple subsystems and external devices.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial-environment systems.
• Low-voltage core: Core supply specified at 870 mV to 930 mV, matching low-voltage power-rail architectures.
• RoHS compliant: Meets common environmental requirements for lead-free assembly.

Why Choose EP2AGX190EF29C4N?

The EP2AGX190EF29C4N combines a high logic element count, substantial embedded RAM, and a high I/O count in a compact 780-FBGA surface-mount package, making it a practical choice for commercial designs that require dense logic and on-chip memory. Its specified core voltage range and commercial temperature rating provide clear electrical and environmental boundaries for system design.

This device is well suited for engineers and procurement teams specifying a commercial-grade Arria II GX FPGA when board space, logic density, and on-chip memory capacity are primary considerations.

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