EP2AGX190EF29C6
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 10177536 181165 780-BBGA, FCBGA |
|---|---|
| Quantity | 97 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7612 | Number of Logic Elements/Cells | 181165 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 10177536 |
Overview of EP2AGX190EF29C6 – Arria II GX FPGA, 181,165 logic elements, 372 I/Os
The EP2AGX190EF29C6 is an Arria II GX field programmable gate array (FPGA) in a 780-BBGA FCBGA package. It provides a high-density programmable fabric with 181,165 logic elements and approximately 10.18 Mbits of embedded memory, paired with 372 user I/Os for complex digital designs.
Designed as a commercial-grade device, this surface-mount FPGA targets applications that require significant logic capacity, on-chip memory, and flexible I/O while operating within a core voltage window of 870 mV to 930 mV and an ambient range of 0°C to 85°C.
Key Features
- High-density logic — 181,165 logic elements to implement complex combinational and sequential logic functions on-chip.
- Embedded memory — Approximately 10.18 Mbits of on-chip RAM, useful for buffering, frame storage, and local data retention.
- Generous I/O — 372 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level interconnects.
- Package and mounting — 780-BBGA (FCBGA) supplier package (780-FBGA, 29×29) with surface-mount mounting for compact board integration.
- Power requirements — Core supply operating range from 870 mV to 930 mV to match system power budgets.
- Commercial operating range — Rated for 0°C to 85°C ambient operation and supplied as a commercial-grade device.
- Programmable I/O and transceiver capabilities — Device family documentation includes programmable I/O element delay and transceiver performance specifications for high-speed serial and parallel interface design considerations.
- Compliance — RoHS-compliant construction for regulatory and environmental concerns.
Typical Applications
- Communications and networking — Implement packet processing, protocol bridging, and interface aggregation where high logic density and numerous I/Os are required.
- Video and image processing — Use on-chip RAM and abundant logic elements for frame buffering, pipeline stages, and custom processing pipelines.
- Custom compute acceleration — Implement hardware-accelerated functions and data-paths that benefit from large logic resources and embedded memory.
- System prototyping and integration — Evaluate and integrate complex digital subsystems that need flexible I/O mapping and reprogrammability.
Unique Advantages
- Substantial on-chip resources: Large logic element count and approximately 10.18 Mbits of embedded RAM reduce reliance on external memory and discrete logic.
- Flexible board-level integration: 372 user I/Os and a 780-BBGA (29×29) package enable dense routing and multiple interface implementations on a single device.
- Power-aware core operation: Defined core voltage range (870 mV–930 mV) supports consistent power planning and supply design.
- Commercial-grade reliability: Rated for 0°C to 85°C operation to suit a range of industrial and commercial deployment scenarios.
- Design-level I/O and transceiver guidance: Family documentation provides programmable I/O timing and transceiver performance details to assist implementation and timing closure.
- RoHS compliance: Environmentally compliant manufacturing reduces end-product regulatory scope.
Why Choose EP2AGX190EF29C6?
The EP2AGX190EF29C6 delivers a balance of high logic density, substantial embedded memory, and a large I/O complement in a compact 780-BBGA FCBGA package. It is suited for designers who need a reprogrammable platform capable of handling complex digital functions, extensive buffering, and multiple external interfaces within a commercial temperature range.
With Arria II GX family documentation covering electrical characteristics, programmable I/O timing, and transceiver performance, this part offers clear implementation guidance to support robust system designs and streamlined integration.
Request a quote or submit a product inquiry to learn availability, pricing, and lead times for EP2AGX190EF29C6.

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