EP2AGX190EF29C6G

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 10177536 181165 780-BBGA, FCBGA

Quantity 487 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7612Number of Logic Elements/Cells181165
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits10177536

Overview of EP2AGX190EF29C6G – Arria II GX FPGA, 780‑FBGA (29×29)

The EP2AGX190EF29C6G is an Arria II GX field programmable gate array (FPGA) designed for high-density logic and embedded memory applications. It delivers a large logic fabric and on-chip RAM alongside a high I/O count in a compact 780‑FBGA (29×29) surface-mount package, targeting commercial electronic designs that require substantial programmable logic and interface capacity.

Key Features

  • Logic Capacity — 181,165 logic elements provide significant programmable logic resources for complex custom processing and control functions.
  • Embedded Memory — Approximately 10.2 Mbits of on-chip RAM (10,177,536 bits) to support buffering, lookup tables, and memory-intensive logic blocks.
  • I/O Resources — 372 user I/O pins for flexible connectivity to peripherals, sensors, and external interfaces.
  • Package and Mounting — Supplied in a 780‑FBGA (29×29) / 780‑BBGA FCBGA package with surface-mount mounting for compact, board-level integration.
  • Power — Core supply range specified at 870 mV to 930 mV to match system power-rail design and sequencing requirements.
  • Operating Range — Commercial temperature grade rated for 0 °C to 85 °C suitable for standard commercial environment deployments.
  • RoHS Compliance — Device is RoHS compliant, supporting current environmental directives for lead-free assembly.

Typical Applications

  • High‑density logic and control — Implement complex state machines, custom processors, and control logic where a large number of logic elements and embedded RAM are required.
  • Data buffering and protocol handling — Use the on‑chip RAM and abundant I/Os for packet buffering, framing, and protocol conversion tasks in communication equipment.
  • Prototyping and evaluation — Suitable for development platforms and proof-of-concept boards that need significant logic resources and flexible I/O routing in a single device.
  • Interface aggregation — Consolidate multiple peripheral interfaces and glue-logic into a single programmable device using the device’s high I/O count.

Unique Advantages

  • Substantial programmable logic: 181,165 logic elements enable consolidation of complex functions into one device, reducing board-level component count.
  • On‑chip memory capacity: Approximately 10.2 Mbits of embedded RAM supports local buffering and fast data access without external memory.
  • High I/O flexibility: 372 I/Os allow broad external connectivity and simplified routing for multi-interface designs.
  • Compact, industry-standard package: The 780‑FBGA (29×29) surface-mount package balances pin count and board area for space-constrained applications.
  • Designed for commercial deployments: Rated for 0 °C to 85 °C operation and RoHS compliant to match standard commercial product requirements.
  • Controlled core supply range: 870–930 mV core voltage specification helps integrate the FPGA into regulated power architectures predictably.

Why Choose EP2AGX190EF29C6G?

The EP2AGX190EF29C6G positions itself as a high-capacity, commercially graded FPGA option where large logic count, substantial embedded memory, and a wide complement of I/Os are required in a compact package. Its combination of 181,165 logic elements, approximately 10.2 Mbits of on‑chip RAM, and 372 I/Os makes it well suited for designers consolidating multiple functions into a single programmable device.

This device is appropriate for engineering teams developing commercial electronics that need scalable logic resources and flexible interfacing while maintaining board area efficiency and compliance with RoHS directives. Its defined voltage and temperature specifications simplify integration into standard commercial power and thermal environments.

Request a quote or submit an inquiry to receive pricing and availability for EP2AGX190EF29C6G and discuss how this Arria II GX FPGA can meet your design requirements.

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