EP2AGX190EF29I3N

The EP2AGX190EF29I3N is an Arria II GX field programmable gate array (FPGA) supplied in a 780-ball fine-pitch BGA (FCBGA) package. It offers high logic density and on-chip embedded memory with a substantial I/O count, packaged and rated for industrial-temperature operation.

Designed for applications that require significant programmable logic, sizable on-chip RAM, and a large number of I/Os, this device delivers a combination of integration and environmental robustness for complex FPGA designs.

Key Features

• Core Logic  Approximately 181,165 logic elements to implement large, complex logic designs.
• Embedded Memory  Approximately 10.18 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density  372 user I/Os to support broad connectivity and parallel interfaces.
• Package  780-ball BGA FCBGA (supplier package: 780-FBGA, 29×29) for a compact, high-pin-count footprint.
• Power  Core supply voltage range 870 mV to 930 mV to match system power-rail requirements.
• Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C.
• Mounting  Surface-mount package suitable for board-level assembly.
• Standards  RoHS-compliant for regulatory and environmental compatibility.
• Arria II Family Capabilities  Part of the Arria II device family that includes GX devices; device documentation describes transceiver specifications, programmable I/O element delay, and programmable output buffer delay.

Typical Applications

• High-density logic designs  Suitable for projects that require approximately 181,165 logic elements to implement large-scale programmable logic functions.
• On-chip buffering and memory  Appropriate where approximately 10.18 Mbits of embedded memory are needed for data buffering, table storage, or state retention.
• High-I/O systems  Designed for boards and modules that require a large number of external interfaces, leveraging 372 available I/Os.

Unique Advantages

• High logic capacity: 181,165 logic elements enable consolidation of complex functions within a single device, reducing inter-chip routing.
• Substantial embedded memory: Approximately 10.18 Mbits of on-chip RAM lowers dependence on external memory for many buffering and LUT requirements.
• Large I/O count: 372 I/Os provide flexibility to implement multiple parallel interfaces or dense external connectivity.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in thermally demanding environments.
• Compact high-pin-count package: 780-BBGA (29×29 FCBGA) packs high functionality into a small board area for space-constrained designs.
• Regulatory compliance: RoHS-compliant for environmentally conscious product development.

Why Choose EP2AGX190EF29I3N?

The EP2AGX190EF29I3N positions itself as a high-density, industrial-grade Arria II GX FPGA option, combining large programmable logic resources, significant on-chip RAM, and extensive I/O in a single 780-ball FCBGA package. Its specified core voltage range and industrial temperature rating make it suitable for robust embedded designs that require reliable operation across a wide thermal range.

This part is well-suited to engineers and procurement teams seeking a scalable programmable-logic solution with substantial internal resources and a compact assembly footprint, backed by the Arria II family documentation and device characteristics.

Request a quote or submit an inquiry today to evaluate EP2AGX190EF29I3N for your next FPGA design.