EP2AGX190EF29I5N

The EP2AGX190EF29I5N is an Arria II GX field-programmable gate array (FPGA) optimized for high-density, industrial-grade applications. It integrates a large logic fabric with substantial on-chip memory and a high I/O count to support complex programmable designs.

Designed for deployment across environments that require extended temperature operation and robust supply characteristics, this device delivers flexibility for system integration while conforming to RoHS requirements.

Key Features

• Logic Capacity — 181,165 logic elements (cells) for implementing complex digital functions and substantial programmable logic.
• Embedded Memory — Approximately 10.18 Mbits of on-chip RAM to support buffering, packet processing, state machines, and intermediate data storage.
• I/O Count — 372 user I/O pins to support broad interface requirements and high fan‑out connectivity.
• Package and Mounting — 780‑BBGA FCBGA package, supplied as 780‑FBGA (29×29), surface-mount for compact board integration.
• Industrial Temperature Range — Rated for operation from –40°C to 100°C, suitable for temperature-challenging installations.
• Core Voltage Range — Core supply voltage range of 870 mV to 930 mV for compatibility with specified power domains.
• Compliance — RoHS compliant to meet lead-free regulatory requirements.
• Family Documentation — Part of the Arria II device family; device handbook and datasheet detail electrical characteristics, I/O timing, and transceiver performance specifications for design reference.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and high I/O count make the device suitable for control logic, sensor aggregation, and real‑time interfacing.
• High‑Density I/O Aggregation — Large number of I/Os supports protocol bridging, packet aggregation, and multi‑channel data routing on a single FPGA.
• Data Path and Buffering — Significant embedded memory enables on‑chip buffering and intermediate data storage for streaming and packetized data paths.
• System Integration — High logic capacity and compact FCBGA packaging enable integration of complex glue logic and custom accelerators into space-constrained boards.

Unique Advantages

• High Logic Density: 181,165 logic elements offer the capacity to implement large, complex designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 10.18 Mbits of embedded RAM reduces external memory dependencies and simplifies board design.
• Broad I/O Resources: 372 I/Os provide flexibility for diverse interface requirements and high channel counts on a single device.
• Industrial Robustness: –40°C to 100°C operating range supports deployment in demanding environmental conditions.
• Compact Surface‑Mount Package: 780‑BBGA (29×29) FCBGA enables dense PCB implementations while maintaining thermal and electrical performance appropriate for this device class.
• Regulatory Compliance: RoHS compliance supports lead‑free assembly processes and regulatory needs.

Why Choose EP2AGX190EF29I5N?

The EP2AGX190EF29I5N combines large programmable logic capacity, plentiful embedded memory, and extensive I/O resources in a single industrial‑grade FCBGA package. Its specified core voltage range and extended operating temperature make it suitable for systems that require reliable, high‑density programmable logic under demanding conditions.

This device is well suited for engineering teams building consolidated, high‑performance digital subsystems where minimizing external components and maximizing on‑chip resources improves board-level integration and reduces system complexity.

Request a quote or submit a pricing inquiry to evaluate EP2AGX190EF29I5N for your next design project.