EP2AGX190FF35C4G

The EP2AGX190FF35C4G is an Arria II GX Field Programmable Gate Array (FPGA) IC. It provides a large logic capacity with 181,165 logic elements and approximately 10.18 Mbits of embedded memory, combined with 612 user I/Os for high-density, I/O-rich designs.

Packaged in a 1152-BBGA (1152-FBGA, 35×35) surface-mount FCBGA and rated for commercial operation from 0 °C to 85 °C, the device operates from a core supply range of 870 mV to 930 mV and is RoHS compliant.

Key Features

• Core Logic Capacity  Provides 181,165 logic elements to implement complex, custom digital logic and parallel processing functions.
• On-Chip Memory  Includes approximately 10.18 Mbits of embedded RAM for buffering, FIFO implementations, and local data storage.
• I/O Density  612 general-purpose I/Os support wide parallel interfaces and multiple high-pin-count connectivity requirements.
• Logic Blocks  Contains 7,612 logic blocks to structure and partition large designs efficiently.
• Power  Operates with a core voltage supply range of 870 mV to 930 mV, enabling design integration around the device’s specified supply window.
• Package & Mounting  Available in a 1152-BBGA (1152-FBGA, 35×35) surface-mount FCBGA package for compact PCB integration.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Communications and Networking  Use the large logic element count and high I/O count to implement protocol handling, custom packet processing, and interface bridging.
• Data Acquisition and Processing  Leverage embedded RAM and extensive logic resources for buffering, preprocessing, and parallel data paths.
• High-Density Interface Control  612 I/Os enable dense parallel interfaces and board-level aggregation of multiple signal buses.

Unique Advantages

• High Logic Capacity: 181,165 logic elements support complex designs without immediate migration to larger families.
• Substantial On-Chip Memory: Approximately 10.18 Mbits of embedded RAM reduces external memory requirements for many data buffering tasks.
• Extensive I/O Count: 612 I/Os simplify integration of multiple peripherals, sensors, and interfaces on a single FPGA.
• Compact FCBGA Package: 1152-BBGA (35×35) surface-mount package balances pin count and board footprint for space-constrained layouts.
• Commercial Temperature Range: Rated 0 °C to 85 °C for mainstream applications and environments.
• RoHS Compliant: Conforms to lead-free and environmental requirements for compliant assemblies.

Why Choose EP2AGX190FF35C4G?

The EP2AGX190FF35C4G positions itself as a high-capacity, I/O-rich FPGA option for designs that require significant on-chip logic resources and embedded memory. Its combination of 181,165 logic elements, approximately 10.18 Mbits of RAM, and 612 I/Os makes it suitable for dense digital implementations where consolidation of functionality is important.

With a surface-mount 1152-FBGA (35×35) package, a defined core voltage range of 870 mV to 930 mV, and commercial temperature grading, the device offers predictable integration parameters for procurement and system design, while maintaining RoHS compliance.

Request a quote or submit your inquiry to evaluate EP2AGX190FF35C4G for your next design and receive pricing and availability information tailored to your requirements.