EP2AGX190FF35C5

The EP2AGX190FF35C5 is an Arria II GX field programmable gate array (FPGA) from Intel, offered in a 1152‑ball Ball Grid Array (FBGA) package. This commercial‑grade, surface‑mount device provides a high logic element count and substantial embedded memory for complex digital designs requiring large logic and I/O resources.

With 181,165 logic elements, approximately 10.18 Mbits of embedded RAM, and 612 user I/Os, the device is targeted at applications that need dense logic integration, significant on‑chip memory, and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• Core logic  181,165 logic elements for implementing large-scale digital designs and parallel datapaths.
• Embedded memory  Approximately 10.18 Mbits of on‑chip RAM to support buffering, lookup tables, and local storage.
• I/O resources  612 I/O pins to accommodate wide external interfacing and multi‑channel connectivity.
• Power  Core supply voltage range specified at 870 mV to 930 mV.
• Package & mounting  1152‑BBGA (FCBGA) package; supplier package specified as 1152‑FBGA (35×35). Surface‑mount mounting type for standard PCB assembly.
• Operating range & grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Implement complex logic functions and parallel processing using the device’s large logic element count and embedded memory.
• I/O‑intensive designs  Leverage 612 I/Os for multi‑channel interfaces, board‑level integration, and dense connector requirements.
• Embedded system integration  On‑chip RAM and abundant logic elements support local data handling and control tasks within embedded platforms.
• Prototyping and evaluation  Commercial‑grade Arria II GX device suited for development and proof‑of‑concept work within the 0 °C–85 °C range.

Unique Advantages

• High logic density: 181,165 logic elements enable substantial logic integration on a single device, reducing system component count.
• Significant on‑chip memory: Approximately 10.18 Mbits of embedded RAM minimizes external memory dependencies for buffering and LUT storage.
• Extensive I/O capability: 612 I/Os allow flexible interfacing with multiple peripherals and high‑pin‑count system architectures.
• Compact system footprint: 1152‑ball FCBGA (35×35) package delivers high integration in a board‑level friendly form factor.
• Low‑voltage core operation: Defined core supply range (870–930 mV) supports predictable power supply design and core stability.
• Regulatory compliance: RoHS compliance supports deployment in regions and products that require restricted‑substance adherence.

Why Choose EP2AGX190FF35C5?

The EP2AGX190FF35C5 positions itself as a high‑density Arria II GX FPGA option for commercial designs that demand extensive logic resources, ample embedded memory, and a broad complement of I/Os in a compact FCBGA package. Its specification set supports complex digital implementations while remaining within the commercial temperature band.

As part of the Arria II GX device family, this FPGA provides a scalable option for designers who need to move between device densities within a consistent architecture and package ecosystem, helping streamline design reuse and board‑level integration decisions.

Request a quote or submit an availability inquiry for EP2AGX190FF35C5, including required quantity and target delivery timeframe, to begin procurement and integration planning.