EP2AGX190FF35C5NAA

The EP2AGX190FF35C5NAA is an Intel Arria II GX field programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package. It provides a high logic element count and extensive I/O capacity for designs that require on-chip logic density and connectivity.

With 181,165 logic elements, approximately 10.18 Mbits of embedded memory and 612 user I/Os, this device targets applications that need substantial programmable logic, embedded RAM and a compact surface-mount package while operating within a commercial temperature range.

Key Features

• Logic Density  Provides 181,165 logic elements to implement complex digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 10.18 Mbits of on-chip RAM for buffering, FIFOs, and storage for intermediate processing.
• I/O Capacity  612 user I/Os to support high pin-count interfaces and multiple parallel channels.
• Package & Mounting  Supplied in a 1152-BBGA, FCBGA package (supplier package: 1152-FBGA 35×35) with surface-mount mounting for compact board integration.
• Power Supply Range  Core/logic supply operating range of 870 mV to 930 mV to match system power design requirements.
• Temperature & Grade  Commercial-grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Implements large, custom digital functions using 181,165 logic elements for parallel processing and complex state machines.
• Memory-intensive functions  Leverages approximately 10.18 Mbits of embedded RAM for buffering, data staging, and on-chip storage tasks.
• Multi-channel I/O systems  Uses 612 I/Os to connect multiple interfaces, sensors, or parallel data lanes in a single FPGA package.
• Compact board-level integration  The 1152-BBGA FCBGA surface-mount package fits designs that require a high pin count in a compact footprint.

Unique Advantages

• High logic capacity: 181,165 logic elements enable complex designs and extensive gate count without external logic expansion.
• Substantial on-chip RAM: Approximately 10.18 Mbits of embedded memory reduces dependence on external memory for intermediate storage and buffering.
• Extensive I/O availability: 612 user I/Os support multiple interfaces and parallel connections directly from the FPGA.
• Space-efficient packaging: 1152-BBGA (35×35) FCBGA and surface-mount mounting help minimize PCB area while providing high pin density.
• Defined supply window: Core voltage range of 870 mV to 930 mV provides a clear design target for power-supply planning.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for typical commercial environments.

Why Choose EP2AGX190FF35C5NAA?

The EP2AGX190FF35C5NAA Arria II GX FPGA combines high logic element count, sizable on-chip memory and broad I/O capability in a compact FCBGA package from Intel. It is well suited to projects that require dense programmable logic, significant embedded RAM and many external connections within a commercial temperature range.

Designers seeking a commercially graded FPGA with clearly defined power and thermal parameters can leverage this device for high-density system integration, prototyping or production designs that benefit from Intel's Arria II GX documentation and platform-level resources.

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