EP2AGX190FF35I3

The EP2AGX190FF35I3 is an Arria II GX field programmable gate array (FPGA) in an industrial I3 speed grade, providing a high-density programmable fabric for complex digital designs. It offers 181,165 logic elements, approximately 10.18 Mbits of embedded memory, and 612 I/Os in a 1152-FBGA (35×35) surface-mount package.

Designed for applications that require significant on-chip logic, memory, and I/O connectivity, this device combines high integration and industrial temperature range operation to support robust embedded and system-level designs.

Key Features

• Core Logic — 181,165 logic elements to implement complex custom logic, state machines, and data paths.
• Embedded Memory — Total RAM capacity of 10,177,536 bits (approximately 10.18 Mbits) for buffering, FIFOs, and on-chip data storage.
• I/O Density — 612 I/O pins to support high-pin-count interfacing and multi-channel connectivity.
• Package & Mounting — 1152-FBGA (35×35) package, surface-mount, suitable for compact board-level integration.
• Voltage Supply — Core supply range from 870 mV to 930 mV, supporting specified operating conditions.
• Industrial Grade & Speed — Grade: Industrial; part number suffix I3 indicates the industrial I3 speed grade within the Arria II GX family.
• Operating Temperature — Rated for −40 °C to 100 °C to meet demanding thermal environments.
• Standards Compliance — RoHS compliant for environmental compliance in assembly and production.
• Family Documentation — Arria II device handbook and device datasheet detail electrical characteristics, transceiver performance, and I/O timing for integration and validation.

Typical Applications

• High-density digital logic — Implement large-scale custom logic functions and control systems using the extensive logic element and embedded memory resources.
• Multi-channel I/O systems — Support designs that require numerous external interfaces or parallel data lanes with the device’s 612 I/Os.
• Signal processing and buffering — Use on-chip memory for real-time buffering, FIFOs, and intermediate data storage in streaming or processing chains.
• Industrial embedded systems — Operate reliably across −40 °C to 100 °C for industrial applications that demand wide temperature tolerance.

Unique Advantages

• Substantial on-chip resources — Large logic element count and multi-megabit embedded RAM enable complex algorithms and deep buffering without immediate external memory dependence.
• High I/O scalability — 612 I/Os allow dense connectivity to peripherals, sensors, and multi-lane interfaces, reducing the need for external I/O expanders.
• Industrial temperature capability — Rated for −40 °C to 100 °C operation to support deployment in harsh or temperature-variable environments.
• Compact, manufacturable package — 1152-FBGA (35×35) surface-mount package supports compact board layouts while enabling high pin count routing.
• Documented device family — Arria II GX family datasheets provide detailed electrical characteristics and guidance for reliable integration and power sequencing.

Why Choose EP2AGX190FF35I3?

The EP2AGX190FF35I3 positions itself as a high-density, industrial-grade FPGA option within the Arria II GX family, delivering a substantial complement of logic elements, embedded memory, and I/O. Its combination of on-chip resources, industrial temperature rating, and a compact 1152-FBGA package makes it suitable for designs requiring integration, I/O bandwidth, and thermal resilience.

This device is well suited for engineering teams building complex embedded systems, multi-channel interfaces, or high-density digital logic implementations that benefit from a documented device family and industrial-grade operation.

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