EP2AGX190FF35I3G

The EP2AGX190FF35I3G is an Arria II GX field-programmable gate array (FPGA) in a 1152-BBGA FCBGA package designed for industrial applications. It delivers a large logic fabric with substantial embedded memory and high I/O density, suitable for designs that require significant on-chip resources and robust operating range.

Key architectural highlights include 181,165 logic elements, approximately 10.18 Mbits of embedded memory, and 612 I/O pins, providing a platform for high-density digital logic, custom processing, and I/O-intensive functions.

Key Features

• Core Logic  181,165 logic elements for implementing complex digital logic and custom architectures.
• Embedded Memory  Approximately 10.18 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Density  612 user I/O pins to accommodate wide bus interfaces, multiple peripherals, and high channel counts.
• Power Supply  Operates from a core voltage range of 870 mV to 930 mV for the FPGA core domain.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35) in a surface-mount form factor for compact board designs.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial temperature environments.
• Standards Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• High-density digital logic  Implement complex state machines, protocol handling, and custom accelerators using the large logic element count.
• Signal processing and embedded functions  Leverage approximately 10.18 Mbits of on-chip RAM for buffering, streaming data paths, and local processing blocks.
• I/O-intensive systems  Utilize 612 I/Os for multi-channel interfaces, high-pin-count peripherals, and wide parallel connections.
• Industrial control and automation  Industrial-grade temperature range and surface-mount packaging make this FPGA suitable for industrial controllers and automation equipment.

Unique Advantages

• Large logic capacity: 181,165 logic elements enable deployment of sizable, integrated digital designs without immediate need for external logic ICs.
• Substantial on-chip memory: Approximately 10.18 Mbits of embedded RAM reduces dependence on external memory for many buffering and streaming tasks.
• High I/O count: 612 I/Os support complex interfacing requirements, simplifying board-level routing for multi-channel systems.
• Industrial operating range: −40°C to 100°C rating provides robustness for industrial environments where temperature tolerance is required.
• Compact surface-mount package: 1152-BBGA / 1152-FBGA (35×35) packaging supports dense PCB layouts and modern assembly processes.
• Regulatory readiness: RoHS-compliant construction supports environmentally conscious manufacturing and supply chain requirements.

Why Choose EP2AGX190FF35I3G?

The EP2AGX190FF35I3G positions itself as a high-capacity, industrial-grade FPGA option with a balance of logic resources, embedded memory, and extensive I/O. Its combination of 181,165 logic elements, approximately 10.18 Mbits of on-chip RAM, and 612 I/Os makes it well suited for engineers building complex, I/O-heavy digital systems and industrial controllers.

With surface-mount 1152-BBGA packaging, a core voltage range of 870 mV to 930 mV, and an operating temperature span from −40°C to 100°C, this device is designed for integration into compact, robust designs that require verifiable component specifications and environmental compliance.

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