EP2AGX190FF35I3NGC

IC FPGA 612 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 612 10177536 181165 1152-BBGA, FCBGA

Quantity 304 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O612Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7612Number of Logic Elements/Cells181165
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits10177536

Overview of EP2AGX190FF35I3NGC – Arria II GX FPGA, 1152-FBGA (35×35)

The EP2AGX190FF35I3NGC is an Intel Arria II GX field programmable gate array offered in a 1152-ball FCBGA package. It combines a low-power 40‑nm FPGA engine with a large logic fabric and plentiful I/O to address mid- to high-performance system integration tasks in industrial applications.

Designed for applications that demand high-bandwidth interfaces and on-chip DSP and memory, this device delivers 181,165 logic elements, approximately 10.18 Mbits of embedded memory, and 612 user I/O pins—supporting integration of serial protocols, memory interfaces, and signal-processing functions.

Key Features

  • Core and Logic 181,165 logic elements provide a substantial programmable fabric for complex logic and control functions.
  • Embedded Memory Approximately 10.18 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Density 612 user I/O pins suitable for multi‑lane interfaces, parallel buses, and mixed-signal front-ends.
  • Transceivers and High‑Speed Interfaces Arria II series architecture includes support for high-rate serial transceivers and common serial protocols, enabling integration with PCI Express, Ethernet, DDR3 memory interfaces, and other high-bandwidth links.
  • DSP and Arithmetic Blocks Architecture includes high-performance DSP resources for signal processing and arithmetic acceleration.
  • Power and Supply Operates from a core supply range of 870 mV to 930 mV compatible with Arria II GX power domains.
  • Package and Mounting Supplied in a 1152-FBGA (35×35) surface-mount package for compact board-level integration.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Security and Configuration Series-level features include support for encrypted configuration files and multiple configuration options (as described in Arria II documentation).
  • Standards and Compliance RoHS compliant.

Typical Applications

  • High‑Performance Networking Implement multi‑lane Ethernet and custom packet-processing logic using abundant I/O and transceiver-capable architecture.
  • Telecommunications and Wireless Infrastructure Use on-chip DSP resources and serial protocol support to accelerate baseband processing and interface to common telecom PHYs.
  • Storage and Host Interfaces Integrate PCIe and other high-speed serial links alongside controller logic and buffering using embedded memory.
  • Broadcast and Video Processing Leverage DSP blocks and large logic capacity for SD/HD/3G SDI and video transport processing chains.
  • Industrial Control and Automation Deploy in systems requiring wide temperature operation, deterministic I/O, and flexible protocol bridging.

Unique Advantages

  • High Logic Capacity: 181,165 logic elements enable complex SoC-style integrations and multi-function designs on a single device.
  • Significant On‑Chip Memory: Approximately 10.18 Mbits of embedded RAM reduces external memory dependency for buffering and real-time data flows.
  • Broad Interface Support: Series-level transceiver and PHY features simplify implementation of PCIe, Ethernet, DDR3, and other high-bandwidth protocols.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in industrial environments.
  • Power‑Efficient 40‑nm FPGA Engine: The Arria II GX architecture balances performance and power for sustained system operation within the specified core voltage range.
  • Ecosystem Integration: Device family documentation references integration with development tools and IP that aid implementation and shorten development cycles.

Why Choose EP2AGX190FF35I3NGC?

The EP2AGX190FF35I3NGC positions itself as a versatile Arria II GX FPGA option for engineers needing substantial logic capacity, embedded memory, and high I/O density in an industrial-grade package. Its combination of DSP resources, serial interface support, and the Arria II architecture provides a practical platform for accelerating signal processing, protocol bridging, and system integration tasks.

This device is well suited for teams building mid- to high-complexity systems that require a balance of performance, on-chip memory, and rugged operating range—backed by the Arria II family documentation and development ecosystem.

Request a quote or submit an inquiry to begin a procurement evaluation for the EP2AGX190FF35I3NGC and discuss availability and ordering details.

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