EP2AGX260EF29C4

The EP2AGX260EF29C4 is an Arria II GX field programmable gate array (FPGA) from Intel, offered in a 780‑FBGA (29×29) surface‑mount package. It provides a high logic density device with substantial embedded memory and a wide set of I/O resources for complex programmable logic designs.

Designed for commercial‑grade systems, this device combines 244,188 logic elements and approximately 12.0 Mbits of on‑chip RAM with 372 user I/Os, enabling integration of large logic, buffering and interface functions in a single FPGA die.

Key Features

• Core Logic Density — 244,188 logic elements provide substantial capacity for implementing complex state machines, datapaths, and custom accelerators.
• Embedded Memory — Total on‑chip RAM of 12,038,144 bits (approximately 12.0 Mbits) for FIFOs, buffers, and storage close to the logic fabric.
• I/O Resources — 372 user I/Os to support multiple parallel interfaces and board‑level connectivity requirements.
• Power Supply Range — Core supply operating range of 0.870 V to 0.930 V to match system power rails and enable predictable core operation.
• Package and Mounting — 780‑BBGA / FCBGA package with a 29×29 supplier device footprint, optimized for surface‑mount assembly.
• Commercial Grade Temperature — Rated operating temperature from 0 °C to 85 °C for commercial applications.
• Standards Compliance — RoHS compliant to meet environmental and manufacturing requirements.
• Documentation — Device is part of the Arria II GX family with electrical and switching characteristics documented in the Arria II Device Handbook (Device Datasheet and Addendum).

Typical Applications

• High‑density programmable logic implementations — Use the device's 244,188 logic elements to consolidate multiple functions into a single FPGA.
• Embedded buffering and memory‑intensive functions — Approximately 12.0 Mbits of on‑chip RAM supports large FIFOs, packet buffering, and local data storage.
• Multi‑interface boards — 372 I/Os enable dense board‑level connectivity for parallel interfaces and custom I/O mixes.

Unique Advantages

• High integration density: 244,188 logic elements reduce the need for multiple discrete devices by enabling complex designs in a single FPGA.
• Substantial embedded memory: Approximately 12.0 Mbits of RAM minimizes external memory dependencies for many buffer and storage tasks.
• Flexible I/O count: 372 user I/Os provide the headroom to implement multiple interfaces and custom pinouts without compromise.
• Compact package footprint: 780‑FBGA (29×29) packaging offers a high‑pin‑count solution in a board‑friendly form factor for surface‑mount assembly.
• Commercial temperature rating: 0 °C to 85 °C supports a wide range of commercial deployment environments.
• RoHS compliant: Meets environmental manufacturing requirements for modern electronic products.

Why Choose EP2AGX260EF29C4?

The EP2AGX260EF29C4 delivers a balanced combination of large logic capacity, significant embedded RAM, and ample I/O in a single commercial‑grade Arria II GX FPGA package. Its specifications make it suitable for designs that require consolidation of complex logic functions, substantial on‑chip buffering, and a flexible I/O count while maintaining a compact board footprint.

Backed by the Arria II device documentation, this device is appropriate for engineering teams seeking a verified, high‑density FPGA solution with clearly specified electrical characteristics and operating conditions.

If you would like pricing, availability, or a formal quote for EP2AGX260EF29C4, submit a quote request or contact sales to request more information and next‑step procurement details.