EP2AGX190FF35I5G

IC FPGA 612 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 612 10177536 181165 1152-BBGA, FCBGA

Quantity 562 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O612Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7612Number of Logic Elements/Cells181165
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits10177536

Overview of EP2AGX190FF35I5G – Arria II GX FPGA, 1152-BBGA (Industrial)

The EP2AGX190FF35I5G is an Intel Arria II GX field-programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package for surface-mount applications. Built on the Arria II device family architecture, it features a 40‑nm low-power programmable logic engine optimized for high-bandwidth serial interfaces and system integration.

This device targets designs that require substantial logic capacity, on-chip RAM, and extensive I/O while meeting industrial operating temperature and RoHS compliance requirements. Common use cases include designs implementing high-speed serial protocols, memory interfaces, and DSP-accelerated functions.

Key Features

  • Core Architecture — Arria II family 40‑nm low-power FPGA engine with adaptive logic modules (ALMs) and eight-input fracturable look-up tables (LUTs) for efficient logic implementation.
  • Logic Capacity — 181,165 logic elements to implement complex custom logic and control functions.
  • Embedded Memory — Approximately 10.18 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
  • DSP and Math — Integrated high-performance DSP resources (family-level capability) including configurable multipliers and hardcoded add/accumulate functions suitable for signal processing tasks.
  • Transceivers & Serial Interfaces — Arria II family supports up to 24 full-duplex CDR-based transceivers operating from 600 Mbps to 6.375 Gbps for implementing protocols such as PCIe, Ethernet, CPRI and others.
  • I/O — Device-specific 612 I/O pins in a modular bank architecture supporting a range of single-ended and differential I/O standards.
  • Package & Mounting — 1152‑BBGA / 1152‑FBGA (35 × 35 mm) surface-mount package for compact board integration.
  • Power & Voltage — Core voltage supply range from 870 mV to 930 mV to match system power-rail requirements.
  • Operating Range & Grade — Industrial grade operation from −40 °C to 100 °C and RoHS compliant.
  • Security & Configuration — Family-level features include AES programming file encryption and multiple configuration options for protecting intellectual property.

Typical Applications

  • High‑speed serial interfaces — Implement multi‑protocol serial links (for example, PCIe, Ethernet, CPRI) using the Arria II family’s transceiver capabilities and protocol-focused hard IP.
  • Memory and storage controllers — Integrate DDR3 and other memory interfaces and use on-chip RAM for buffering and re-timing functions.
  • Signal processing and DSP — Accelerate filtering, FFTs, and other DSP kernels using the device’s dedicated DSP resources and configurable multipliers.
  • Networking and telecom systems — Build packet processing, protocol bridging, and lane aggregation leveraging abundant logic, I/O, and transceiver performance.

Unique Advantages

  • Substantial logic density: 181,165 logic elements enable large-scale custom logic implementations without external ASICs.
  • Generous embedded memory: Approximately 10.18 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage tasks.
  • Robust serial connectivity: Family-level transceiver support up to 6.375 Gbps allows integration of modern, high-bandwidth serial protocols.
  • Industrial-grade operation: Rated −40 °C to 100 °C for deployments that require extended temperature tolerance.
  • Compact BGA package: 1152‑BBGA footprint provides a dense, manufacturable solution for space-constrained boards.
  • Security and configuration options: Support for AES programming file encryption and flexible configuration modes helps protect IP and simplify provisioning.

Why Choose EP2AGX190FF35I5G?

The EP2AGX190FF35I5G combines the Arria II GX family architecture with device-level resources that suit demanding designs requiring high logic capacity, plentiful on-chip memory, and extensive I/O. Its industrial temperature rating and RoHS compliance make it suitable for applications that must operate reliably across a wide thermal range.

This device is well suited to engineers building high-bandwidth interfaces, DSP-accelerated systems, and complex protocol implementations who need a highly integrated FPGA platform with strong ecosystem support for design tools and IP.

Request a quote or submit a sales inquiry to evaluate EP2AGX190FF35I5G for your next design.

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