EP2AGX190FF35I3N

The EP2AGX190FF35I3N is an Arria II GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA package designed for applications that require high logic capacity, substantial on-chip memory, and a large I/O count. This industrial-grade FPGA combines a dense logic fabric with embedded RAM and broad I/O to support complex, programmable hardware implementations.

Key Features

• Logic Capacity — 181,165 logic elements available for custom digital designs and hardware acceleration.
• Embedded Memory — Approximately 10 Mbits of embedded memory (10,177,536 total RAM bits) for buffering, state storage, and on-chip data structures.
• I/O Density — 612 user I/O pins to connect peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Power Core Range — Core voltage supply range of 870 mV to 930 mV for compatibility with low-voltage core power rails.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) with surface-mount packaging for standard PCB assembly.
• Industrial Temperature — Rated operating temperature from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Compliance — RoHS compliant.

Typical Applications

• Custom Hardware Acceleration — Implement compute-intensive functions using the FPGA’s 181,165 logic elements and embedded memory for low-latency processing.
• High-Density I/O Subsystems — Systems that require many direct external interfaces can leverage the 612 I/O pins for flexible connectivity.
• Industrial Control and Automation — Industrial-grade temperature range and surface-mount packaging make the device suitable for ruggedized control electronics and automation platforms.
• Prototyping and System Integration — Large on-chip memory and logic resources support complex prototypes and integration of multiple functions into a single programmable device.

Unique Advantages

• High logic density: 181,165 logic elements enable integration of complex digital functions without external ASICs.
• Significant embedded memory: Approximately 10 Mbits of on-chip RAM reduce dependence on external memory for many applications.
• Extensive I/O capacity: 612 I/Os facilitate dense peripheral and subsystem connections directly to the FPGA fabric.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in a wide range of environmental conditions.
• Low-voltage core operation: 870 mV to 930 mV core supply range aligns with modern low-voltage power architectures.
• Standard surface-mount packaging: 1152-ball FCBGA (35×35) package simplifies PCB assembly for production designs.

Why Choose EP2AGX190FF35I3N?

EP2AGX190FF35I3N positions itself as a high-capacity, industrial-grade FPGA option for designs that need substantial programmable logic, embedded memory, and broad I/O connectivity. Its combination of 181,165 logic elements, approximately 10 Mbits of on-chip RAM, and 612 I/Os makes it well suited to consolidating multiple functions into a single programmable device while operating across a wide temperature range.

Designed for engineers and procurement teams seeking a robust FPGA platform, this Arria II GX device provides the raw resources required for complex custom logic, prototyping, and industrial deployments without compromising on assembly compatibility or RoHS compliance.

Request a quote or submit an inquiry to start procurement for EP2AGX190FF35I3N and receive pricing and availability details for your project needs.