EP2AGX190FF35C6G

The EP2AGX190FF35C6G is an Arria II GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It delivers high programmable logic capacity and broad I/O density in a surface-mount commercial-grade device.

With 181,165 logic elements, approximately 10.18 Mbits of embedded memory and 612 I/O pins, this device is intended for designs that require significant on-chip logic, memory and interface consolidation while operating from a low-voltage supply.

Key Features

• Core Logic  181,165 logic elements for large-scale programmable logic integration.
• Embedded Memory  Approximately 10.18 Mbits of on-chip RAM for buffering, data storage and state machines.
• I/O Density  612 I/O pins to support multi-channel interfaces and high-pin-count designs.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35); surface-mount mounting for PCB integration.
• Power Supply  Operates from a supply range of 870 mV to 930 mV to match low-voltage system rails.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• High-density digital designs  Use the device where large programmable logic capacity and on-chip memory are needed for complex combinational and sequential logic.
• Multi-interface systems  Leverage 612 I/O pins to consolidate and route multiple external interfaces on a single FPGA.
• Embedded system prototyping  Apply the FPGA’s logic and memory resources for rapid prototyping and iterative hardware development.

Unique Advantages

• Substantial logic capacity: 181,165 logic elements enable implementation of large logic networks without external CPLD/ASIC offloads.
• Significant on-chip memory: Approximately 10.18 Mbits of embedded RAM reduces dependence on external memory for buffering and data-path functions.
• High I/O count: 612 I/O pins support dense connectivity and multiple simultaneous interfaces, simplifying board-level routing.
• Compact, manufacturable package: 1152-BBGA FCBGA (35×35) in a surface-mount form factor eases PCB assembly for volume production.
• Low-voltage compatibility: Operates from 870 mV to 930 mV, aligning with low-voltage system rails and modern power domains.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP2AGX190FF35C6G?

The EP2AGX190FF35C6G positions large programmable logic capacity, substantial embedded memory and extensive I/O in a commercially graded, RoHS-compliant 1152-BBGA package. Its low-voltage supply range and surface-mount package make it suitable for compact, board-level integration where on-chip resources reduce external component count.

This device is well suited to teams and projects that require scalable logic and memory resources with high I/O density, offering a balance of integration and manufacturability backed by Intel’s Arria II GX family documentation.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX190FF35C6G.