EP2AGX190FF35C6

The EP2AGX190FF35C6 is an Intel Arria II GX field programmable gate array (FPGA) offered in a commercial grade. It provides a high density of programmable logic as well as substantial on-chip embedded memory and a large I/O count, in a 1152-ball FCBGA package.

Designed for applications requiring extensive programmable logic, embedded RAM, and dense I/O, this device delivers a combination of integration and electrical characteristics aimed at commercial embedded and board-level designs.

Key Features

• Programmable Logic Capacity — 181,165 logic elements to implement complex digital logic and system-level functions.
• Logic Blocks — 7,612 programmable logic blocks for structured resource partitioning and design mapping.
• Embedded Memory — Approximately 10.18 Mbits of on-chip RAM for local data buffering, FIFOs, and state storage.
• I/O Density — 612 user I/O pins to support multi‑device interfaces, parallel buses, and mixed-signal front-ends.
• Package and Mounting — 1152-BBGA, FCBGA supplier package (1152-FBGA (35×35)) with surface-mount mounting for high-pin-count board designs.
• Power and Core Voltage — Core supply range of 870 mV to 930 mV to match system power rails and enable defined core performance points.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to meet commercial embedded application environments.
• Regulatory Compliance — RoHS compliant for environmental and lead-free manufacturing requirements.

Typical Applications

• High-density digital logic — Implement complex state machines, protocol engines, and custom datapaths using 181,165 logic elements and 7,612 logic blocks.
• Memory-intensive buffering — Use approximately 10.18 Mbits of embedded RAM for packet buffering, FIFO staging, and local scratch memory.
• Multi-I/O systems — Integrate diverse peripheral interfaces and parallel buses with up to 612 I/O pins.
• Commercial embedded platforms — Suitable for board- and system-level designs targeting commercial temperature ranges and RoHS-compliant production.

Unique Advantages

• High logic density: 181,165 logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
• Substantial on-chip memory: Approximately 10.18 Mbits of RAM supports large buffers and stateful designs without immediate external memory dependence.
• Large I/O count: 612 user I/Os provide flexibility for interfacing to a wide set of peripherals and parallel interfaces.
• Compact, high-pin-count packaging: 1152-ball FCBGA package supports high signal density in space-constrained PCBs.
• Commercial-grade robustness: Rated for 0 °C to 85 °C operation and RoHS compliant to align with commercial manufacturing and deployment.
• Controlled core supply range: Defined 870 mV–930 mV core voltage range for predictable power and timing behavior in system designs.

Why Choose EP2AGX190FF35C6?

The EP2AGX190FF35C6 combines large programmable logic capacity, significant embedded memory, and a high I/O count in a single commercial-grade Arria II GX FPGA package. These characteristics make it well suited for designers who need to implement complex digital systems, integrate multiple interfaces, and manage substantial on-chip data buffering within a RoHS-compliant commercial product.

Choosing this device supports scalability within the Arria II GX family and helps streamline board-level integration thanks to its high pin count and surface-mount FCBGA packaging. It is targeted at engineers and procurement teams building commercial embedded systems that require a high degree of programmability and on-chip resources.

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