EP2AGX190FF35C5N

The EP2AGX190FF35C5N is an Intel Arria II GX family field-programmable gate array (FPGA) supplied in a 1152-BBGA / 1152-FBGA (35×35) package. The device provides a high-density programmable logic fabric with 181,165 logic elements and approximately 10.18 Mbits of embedded on-chip RAM, paired with a 612-pin I/O count for extensive external connectivity.

Designed for commercial-grade applications (0 °C to 85 °C) and RoHS-compliant assemblies, this surface-mount FPGA is suitable for projects that require large programmable logic capacity, substantial embedded memory, and a high number of I/O connections.

Key Features

• Logic Capacity  Delivers 181,165 logic elements to implement complex custom logic, state machines, and control paths.
• On‑chip Memory  Approximately 10.18 Mbits of embedded RAM to support buffering, local storage, and memory-intensive algorithms.
• I/O Resources  612 general-purpose I/O pins to support wide external connectivity and interface diversity.
• Package & Mounting  1152-BBGA (FCBGA) / 1152-FBGA (35×35) package in a surface-mount form factor for high-density PCB implementations.
• Power  Core supply operating range of 0.870 V to 0.930 V to align with Arria II GX device power requirements.
• Operating Grade  Commercial temperature range of 0 °C to 85 °C for standard commercial deployments.
• Compliance  RoHS‑compliant to meet restricted‑substance environmental requirements.

Typical Applications

• High-density logic designs  Use the device’s 181,165 logic elements to implement large custom finite-state machines, protocol engines, or complex combinational/sequential logic.
• Embedded memory buffering  Leverage approximately 10.18 Mbits of on-chip RAM for frame buffers, packet buffering, or local data storage close to logic.
• High‑I/O interfacing  Employ the 612 I/Os for multi‑lane parallel interfaces, extensive sensor arrays, or board-level aggregation of peripherals.

Unique Advantages

• Substantial programmable logic  A high logic-element count enables consolidation of multiple functions into a single device, reducing board complexity.
• Significant on-chip RAM  Approximately 10.18 Mbits of embedded memory reduces dependence on external RAM for many buffering and caching tasks.
• Large I/O capacity  612 I/Os allow flexible system interconnects and support for wide parallel interfaces without immediate need for external GPIO expanders.
• Industry-standard package  1152‑BBGA / 1152‑FBGA (35×35) packaging supports compact, high-density PCB layouts and surface-mount assembly processes.
• Commercial temperature and compliance  Commercial (0 °C to 85 °C) rating and RoHS compliance simplify qualification for mainstream electronic products.

Why Choose EP2AGX190FF35C5N?

The EP2AGX190FF35C5N positions itself as a high-density Arria II GX FPGA option for commercial designs that demand substantial programmable logic, embedded RAM, and broad I/O capability. Its combination of 181,165 logic elements, roughly 10.18 Mbits of on-chip memory, and 612 I/Os makes it suitable for consolidating complex functions and reducing external component count.

Backed by Arria II family documentation, this device is appropriate for engineering teams seeking a documented FPGA platform with well-defined electrical and operating parameters (0.870–0.930 V core supply and 0 °C to 85 °C operating range) and RoHS compliance for environmental requirements.

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