EP2AGX190FF35I5

The EP2AGX190FF35I5 is an Arria II GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA/BBGA package intended for surface-mount applications. It delivers high logic density and on-chip memory for complex programmable logic designs, while providing extensive I/O and support for the Arria II GX device family feature set.

This device is offered in an industrial grade and is specified for a wide operating temperature range and a defined core supply voltage range, making it suitable for demanding embedded and industrial systems that require programmable logic, substantial embedded RAM, and large I/O counts.

Key Features

• Logic Capacity  181,165 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 10.18 Mbits of total on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Resources  612 I/O pins to interface with sensors, processors, memory devices, and high-density system connectors.
• Power  Specified core voltage supply range of 870 mV to 930 mV for the device core.
• Package & Mounting  1152-FBGA (35x35) supplier package / 1152-BBGA, FCBGA package case; surface-mount mounting type simplifies PCB assembly for compact systems.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C and designated as an industrial-grade device.
• Standards and Family Features  Part of the Arria II GX device family; family documentation includes transceiver and PCI Express (PCIe) HIP block specifications and detailed electrical and switching characteristics.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature range and abundant logic/I/O resources make the device suitable for programmable control, motor drives, and automation interfaces.
• High-Density I/O Systems  Large I/O count supports complex sensor arrays, data acquisition front ends, and multi-channel I/O aggregation.
• Memory-Intensive Logic  Approximately 10.18 Mbits of on-chip RAM enables buffering and local data processing for stream handling and packet buffering.
• Transceiver-Based Designs  As part of the Arria II GX family, the device aligns with applications that require transceiver performance and PCIe HIP block support as documented for the family.

Unique Advantages

• High Logic Density:  181,165 logic elements let you implement complex state machines, DSP pipelines, and custom accelerators without external logic.
• Significant Embedded Memory:  Approximately 10.18 Mbits of on-chip RAM reduces dependency on external memory for many buffering and LUT requirements.
• Extensive External Connectivity:  612 I/O pins give designers flexibility to connect to a wide range of peripherals and high-pin-count interfaces.
• Industrial Reliability:  Industrial grade and −40 °C to 100 °C operating range support deployment in temperature-challenging environments.
• Compact BGA Packaging:  1152-ball FCBGA/BBGA packaging enables high-density PCB layouts while maintaining robust electrical connections for complex systems.
• RoHS Compliant:  Meets RoHS requirements for lead-free manufacturing processes.

Why Choose EP2AGX190FF35I5?

The EP2AGX190FF35I5 combines high logic capacity, substantial embedded RAM, and a large I/O count in an industrial-grade Arria II GX FPGA package. It is well suited for engineers designing complex embedded systems that require on-chip memory, abundant programmable logic, and flexible I/O while operating across a wide temperature range.

Selecting this device provides designers with the Arria II GX family documentation and device-level electrical characteristics for accurate system integration, along with a compact 1152-ball FBGA/BBGA package for dense board-level implementations.

Request a quote for EP2AGX190FF35I5 to receive pricing and availability information or to submit a formal RFQ for your project needs.