EP2AGX260EF29C4G

The EP2AGX260EF29C4G is an Intel Arria II GX field programmable gate array supplied in a 780-pin FCBGA package (780-FBGA, 29×29) designed for surface-mount assembly. It offers a high logic capacity and substantial on-chip memory, making it suitable for designs that require dense digital logic and embedded storage within a commercial temperature range.

Key attributes include 244,188 logic elements, approximately 12.04 Mbits of embedded RAM, 372 I/O pins, and an operating supply range of 870 mV to 930 mV. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.

Key Features

• Core Logic  The device provides 244,188 logic elements to implement complex custom digital functions and high-density logic architectures.
• Embedded Memory  Approximately 12.04 Mbits of on-chip RAM for buffering, lookup tables, and local data storage within user designs.
• I/O  372 user I/O pins for flexible interfacing to external devices, peripherals, and board-level signals.
• Power  Specified core supply range of 870 mV to 930 mV to match system power-rail requirements and enable controlled power sequencing.
• Package & Mounting  780-BBGA / FCBGA package in a 29×29 format for high-density board integration; surface-mount mounting type.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard-temperature embedded and system applications.
• Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Custom Digital Logic  Implement complex, application-specific logic using 244,188 logic elements to realize state machines, data paths, and control logic.
• Embedded Memory Functions  Use approximately 12.04 Mbits of on-chip RAM for buffering, LUTs, and temporary data storage in system designs.
• High-Density I/O Systems  Leverage 372 I/O pins for interfacing with multiple peripherals, sensors, and board-level buses in compact systems.

Unique Advantages

• High Logic Capacity: 244,188 logic elements enable implementation of large, integrated digital designs without immediate need for additional logic devices.
• Substantial On-Chip Memory: Approximately 12.04 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Flexible I/O: 372 I/O pins provide broad interfacing options for mixed-signal and multi-peripheral systems.
• Compact, Surface-Mount Package: 780-FBGA (29×29) package supports high-density PCB layouts and automated assembly processes.
• Commercial Temperature Range and RoHS Compliance: Designed for standard commercial environments and modern manufacturing requirements.

Why Choose EP2AGX260EF29C4G?

The EP2AGX260EF29C4G positions itself as a high-capacity, commercially graded FPGA tailored for designs that require extensive logic resources, embedded memory, and flexible I/O in a compact surface-mount package. Its electrical and thermal specifications support predictable integration into commercial systems where on-chip resources and board density are key considerations.

This device is well suited to engineering teams and procurement groups looking for an FPGA with substantial logic and memory resources, a defined supply voltage range, and RoHS compliance for streamlined manufacturing and long-term product support.

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