EP2AGX260EF29C5N

The EP2AGX260EF29C5N is an Arria II GX field-programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It provides a high-capacity programmable logic fabric with significant embedded RAM and a large complement of I/O for demanding commercial applications.

Built for designs that require dense logic, substantial on-chip memory, and broad I/O connectivity, this commercial-grade device supports core supply operation in the 0.870–0.930 V range and a 0 °C to 85 °C operating temperature window.

Key Features

• High Logic Capacity — 244,188 logic elements enabling complex programmable logic implementations and large-scale custom fabric integration.
• Embedded Memory — Approximately 12.04 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions without external memory dependence.
• Extensive I/O — 372 I/O pins to support dense board-level interfacing and multiple parallel or serial interfaces.
• Power and Operating Range — Core voltage supply range of 870 mV to 930 mV; commercial operating temperature range of 0 °C to 85 °C for standard environmental deployments.
• Package and Mounting — 780-ball FCBGA package (29×29) with surface-mount mounting type for compact, board-level integration.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and material compliance.

Typical Applications

• High-density logic implementations — Designs requiring large programmable fabrics can leverage 244,188 logic elements for complex state machines, datapath processing, and custom accelerators.
• Embedded buffering and memory functions — Applications that need substantial on-chip storage can use approximately 12.04 Mbits of RAM for packet buffering, FIFOs, or lookup tables.
• I/O-intensive systems — Systems requiring many external interfaces or parallel connections benefit from 372 I/O pins to accommodate sensors, peripherals, and board-level buses.

Unique Advantages

• High integration density: 244,188 logic elements and large embedded RAM reduce dependence on external logic and memory, simplifying BOM and board routing.
• Flexible I/O support: 372 I/O pins provide broad connectivity options for mixed-signal front ends, interface bridging, and multi-channel systems.
• Commercial-grade robustness: Specified for 0 °C to 85 °C operation, suitable for standard commercial environments and applications.
• Compact board footprint: 780-ball FCBGA (29×29) packaging delivers high density in a surface-mount form factor for space-constrained designs.
• Regulatory-friendly materials: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP2AGX260EF29C5N?

The EP2AGX260EF29C5N positions itself as a high-capacity Arria II GX FPGA for commercial applications that demand a balance of dense programmable logic, sizable on-chip memory, and extensive I/O. Its voltage and temperature specifications make it a straightforward drop-in for board designs targeting standard commercial environments.

Design teams seeking a solution with substantial embedded resources and a compact FCBGA footprint will find this device aligned with medium- to high-complexity logic integration, on-chip buffering, and multi-interface connectivity needs.

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