EP2AGX260EF29C6G

The EP2AGX260EF29C6G is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-density programmable logic fabric in a 780-BBGA FCBGA package. With 244,188 logic elements and approximately 12.0 Mbits of embedded memory, it is targeted at designs that require substantial on-chip resources and flexible I/O.

Packaged for surface-mount assembly and rated for commercial operating temperatures, this device provides a balance of integration, I/O capacity and on-chip RAM for complex digital designs within a specified core voltage window.

Key Features

• Core Logic — 244,188 logic elements provide significant programmable logic capacity for complex digital functions and custom datapaths.
• Embedded Memory — Approximately 12.0 Mbits of on-chip RAM (12,038,144 bits) for buffering, FIFOs and state storage without external memory.
• I/O Density — 372 user I/O pins to support multiple peripherals, high-pin-count interfaces and board-level integration.
• Power — Specified voltage supply range of 870 mV to 930 mV to match system power rails and core requirements.
• Package & Mounting — 780-BBGA (FCBGA) package, supplier package listed as 780-FBGA (29×29), designed for surface-mount assembly.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to meet standard lead-free requirements.

Typical Applications

• High-density digital processing — Implements custom datapaths and parallel processing functions that benefit from 244,188 logic elements and substantial embedded RAM.
• Custom interface and protocol bridging — Leverages 372 I/O pins to connect and translate between multiple board-level interfaces and peripherals.
• On-chip buffering and streaming — Uses approximately 12.0 Mbits of embedded memory for packet buffering, FIFOs and temporary data storage within complex systems.

Unique Advantages

• High logic capacity: 244,188 logic elements enable dense implementation of custom logic, state machines and parallel functions.
• Large on-chip memory: Approximately 12.0 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: 372 I/O pins allow flexible connectivity and support for multiple high-pin-count interfaces on a single device.
• Compact BGA footprint: 780-BBGA (29×29) package provides a compact board-level solution suited to surface-mount assembly.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to meet standard commercial product requirements.

Why Choose EP2AGX260EF29C6G?

The EP2AGX260EF29C6G positions itself as a high-density Arria II GX FPGA option from Intel, combining a large logic element count with substantial embedded memory and broad I/O capability in a BGA package. Its specified voltage range and commercial operating temperature make it suitable for systems that require on-chip integration of logic and memory without moving to specialized temperature grades.

This device is appropriate for design teams seeking a programmable platform with significant on-chip resources for custom digital processing, interface consolidation, and buffering, while maintaining standard surface-mount packaging and RoHS compliance.

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