EP2AGX260EF29I3

The EP2AGX260EF29I3 is an Intel Arria II GX Field Programmable Gate Array (FPGA) supplied in a 780-BBGA FCBGA package. The device delivers a high count of programmable logic resources and embedded RAM in a surface-mount, industrial-grade package suitable for demanding embedded applications.

With 244,188 logic elements and approximately 12.04 Mbits of on-chip RAM, the device supports designs that require significant logic capacity, substantial embedded memory, and a large number of I/O signals while operating from a low-voltage core supply.

Key Features

• Logic Capacity — 244,188 logic elements for complex programmable logic implementations.
• Embedded Memory — Approximately 12.04 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
• I/O Density — 372 user I/Os to interface with multiple peripherals, buses, and high-pin-count designs.
• Package and Mounting — 780-BBGA (780-FBGA, 29×29) package in a surface-mount form factor for compact PCB integration.
• Voltage Supply — Core supply range of 0.87 V to 0.93 V to match low-voltage system domains.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for extended environmental tolerance.
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Communications and Networking — Large logic capacity and abundant I/Os enable packet-processing engines, interface bridging, and protocol handling.
• Signal Processing — Substantial embedded RAM and high logic counts support data buffering and custom DSP pipelines.
• High-density Embedded Systems — Surface-mount 780-FBGA packaging and industrial temperature rating fit compact, rugged embedded designs.
• Prototyping and System Integration — Programmable fabric and broad I/O enable rapid implementation of complex system functions and board-level integration.

Unique Advantages

• High Logic Density: 244,188 logic elements provide the capacity to implement large-scale digital designs without partitioning across multiple devices.
• Significant On-chip Memory: Approximately 12.04 Mbits of embedded RAM reduces external memory dependency for many buffering and state-retention tasks.
• Broad I/O Support: 372 I/Os accommodate multiple interfaces and parallel buses, simplifying board-level connectivity.
• Industrial Reliability: Specified operation from –40 °C to 100 °C supports deployments in thermally demanding environments.
• Compact Packaging: 780-FBGA (29×29) surface-mount package enables dense PCB layouts while preserving signal routing flexibility.
• Low-voltage Core Operation: Core supply between 0.87 V and 0.93 V aligns with modern low-voltage system architectures.

Why Choose EP2AGX260EF29I3?

The EP2AGX260EF29I3 combines a large programmable logic fabric with substantial on-chip RAM and a high I/O count in an industrial-grade, surface-mount 780-FBGA package. Its specification set is aimed at designs that require a significant amount of embedded logic and memory while maintaining a compact footprint and broad environmental tolerance.

This device is well suited for engineers and procurement teams building complex embedded systems, communications equipment, or signal-processing platforms that benefit from integrated memory, flexible I/O, and industrial temperature operation. Its combination of resources supports scalable designs and long-term deployment requirements.

Request a quote or submit an inquiry to receive pricing and availability for EP2AGX260EF29I3 and to discuss how this Arria II GX FPGA can meet your project requirements.