EP2AGX260EF29I3G

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA

Quantity 1,227 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10260Number of Logic Elements/Cells244188
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits12038144

Overview of EP2AGX260EF29I3G – Arria II GX FPGA IC, 244,188 logic elements, 372 I/Os

The EP2AGX260EF29I3G is an Intel Arria II GX field programmable gate array (FPGA) in a 780-BBGA FCBGA package optimized for high-density, low-power programmable logic. It combines a 40‑nm programmable logic engine with abundant I/O and embedded memory to address designs that require complex logic, high-bandwidth interfaces, and industrial temperature operation.

This device is suited to communications, networking, video and industrial applications that benefit from integrated transceivers, substantial on‑chip memory, and a compact surface-mount BGA package.

Key Features

  • Core architecture  40‑nm low‑power FPGA engine with adaptive logic modules and eight‑input fracturable look‑up tables as part of the Arria II device family architecture.
  • Logic capacity  244,188 logic elements to implement complex control, signal processing and protocol logic.
  • Embedded memory  Approximately 12.0 Mbits of on‑chip RAM for FIFOs, buffers and local storage.
  • I/O and transceivers  372 user I/Os and support in the Arria II family for full‑duplex CDR‑based transceivers (family-level support up to 24 transceivers and data rates up to 6.375 Gbps).
  • Interfaces and protocol support  Family architecture provides hard and soft IP support for common serial and parallel interfaces including PCIe, Ethernet and DDR3 (refer to Intel Arria II documentation for available IP options).
  • Power and voltage  Nominal core voltage range 870 mV to 930 mV enabling low‑voltage system designs.
  • Package & mounting  780‑FBGA (29 × 29 mm) FCBGA package, surface‑mount for compact PCB integration.
  • Industrial temperature rating  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Design ecosystem  Supported by the Arria II device family design flows and Intel tools for integration of hard and soft IP (see Intel Arria II documentation for tool support).
  • RoHS compliant  Device meets RoHS environmental requirements.

Typical Applications

  • High‑speed networking & telecom  Use the device where multi‑Gbps serial links and protocol IP (PCIe, Ethernet, CPRI and others in the Arria II family) are required for line cards, aggregation and backplane interfaces.
  • Storage and connectivity  Implement storage controllers and protocol bridges that leverage large logic capacity, substantial on‑chip RAM and high I/O counts.
  • Video and broadcast processing  Deploy for SD/HD/3G video interface processing and transport where deterministic I/O and embedded memory are needed for buffering and timing.
  • Industrial control and automation  Industrial temperature rating and flexible I/O make the device suitable for control systems, motor control interfaces and real‑time signal handling.

Unique Advantages

  • High logic density: 244,188 logic elements enable large, integrated designs and reduce the need for multi‑chip implementations.
  • Significant on‑chip RAM: Approximately 12.0 Mbits of embedded memory for local buffering, FIFOs and memory‑intensive algorithms.
  • Broad protocol support: Arria II family support for PCIe, Ethernet, DDR3 and multiple serial protocols simplifies integration of common system interfaces.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in harsh and industrial environments.
  • Compact BGA package: 780‑FBGA (29 × 29 mm) surface‑mount package delivers high pin count in a compact footprint for dense PCBs.
  • Low‑voltage core: 870–930 mV supply range supports power‑sensitive designs and system power optimization.

Why Choose EP2AGX260EF29I3G?

The EP2AGX260EF29I3G delivers a balance of high logic capacity, generous embedded memory and substantial I/O in a compact FCBGA package. Its 40‑nm Arria II GX architecture and family support for high‑speed serial protocols make it appropriate for designs that require integrated protocol handling, buffering and real‑time processing within industrial temperature environments.

This device suits engineering teams building communications, storage, video and industrial systems that need a scalable FPGA solution backed by the Arria II device family documentation and design flows.

Request a quote or submit a product inquiry to receive pricing, availability and technical support information for EP2AGX260EF29I3G.

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