EP2AGX260EF29I5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA |
|---|---|
| Quantity | 264 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10260 | Number of Logic Elements/Cells | 244188 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12038144 |
Overview of EP2AGX260EF29I5G – Arria II GX FPGA, 780-BBGA (FCBGA)
The EP2AGX260EF29I5G is an Intel Arria II GX field-programmable gate array supplied in a 780-ball FCBGA package and rated for industrial operation. It delivers a high logic count and substantial on-chip memory, making it suitable for designs that require programmable logic, abundant I/O, and integration with high-speed serial interfaces.
As part of the Arria II device family, this device is built on the family architecture optimized for low-power operation and integration with common system interfaces. It targets applications that benefit from significant embedded memory, extensive I/O, and flexible logic resources.
Key Features
- Logic Capacity — 244,188 logic elements provide substantial programmable logic for complex functions and custom processing pipelines.
- Embedded Memory — Approximately 12.0 Mbits of on-chip RAM (12,038,144 bits) to support FIFOs, buffering, and data-path storage without external memory.
- I/O Density — 372 user I/O pins in a modular, surface-mount 780-FBGA (29×29) package to support a variety of interfaces and board-level routing requirements.
- Industrial Operating Range — Rated for -40°C to 100°C operation and classified as Industrial grade for reliable performance in demanding environments.
- Power Supply — Core voltage range specified at 870 mV to 930 mV to match system power planning and regulator design.
- Arria II Family Capabilities — Family-level features include a 40‑nm low-power FPGA engine, adaptive logic modules with 8-input LUTs, DSP blocks for high-performance arithmetic, and support for high-speed serial transceivers and common protocols.
- Package & Mounting — 780-BBGA FCBGA surface-mount package for compact board integration and thermal considerations.
- Standards & Security (Family) — Arria II family documentation highlights integrated configuration options and AES programming-file encryption features for design security.
Typical Applications
- Telecommunications & Networking — Implement protocol bridging, packet processing, and high-speed serial interfaces where on-chip memory and abundant logic accelerate data-paths.
- Storage & Connectivity — Gateware for host interfaces, RAID offload, and custom protocol handling that leverage the device’s logic density and I/O resources.
- Video & Broadcast Systems — Real-time data buffering and format conversion using embedded RAM and DSP resources drawn from the Arria II family capabilities.
- Industrial Control & Test Equipment — Deterministic custom logic and I/O interfacing in industrial-temperature environments requiring robust operation.
Unique Advantages
- High Logic Density: 244,188 logic elements enable integration of complex control, processing, and protocol logic into a single device, reducing BOM count.
- Substantial On-Chip RAM: Approximately 12.0 Mbits of embedded memory help minimize external memory requirements for buffering and state storage.
- Industrial Temperature Rating: Specified operation from -40°C to 100°C supports deployment in industrial and harsh-environment applications.
- Flexible I/O Count and Package: 372 I/Os in a 780-FBGA (29×29) surface-mount package simplify routing for dense board designs while supporting a wide range of interfaces.
- Family-Level Integration: Access to Arria II family features—such as DSP blocks, configurable multipliers, and transceiver support—enables faster implementation of high-bandwidth system interfaces.
Why Choose EP2AGX260EF29I5G?
The EP2AGX260EF29I5G balances dense programmable logic, meaningful embedded memory, and a high I/O count in an industrial-rated FCBGA package. It is positioned for designs that require on-chip resources to reduce external components while maintaining reliable operation across a wide temperature range.
This device is well suited for system designers and OEMs building telecommunications, connectivity, industrial control, and video applications that leverage the Arria II family architecture for integration, performance, and security features documented for the series.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for the EP2AGX260EF29I5G. Our team can provide configuration and ordering assistance tailored to your project requirements.

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