EP2AGX260FF35C4G

The EP2AGX260FF35C4G is an Arria II GX field programmable gate array (FPGA) from Intel, supplied in a 1152‑BBGA (35×35) FCBGA surface‑mount package. It is a commercial‑grade programmable logic device offering high logic density, substantial on‑chip memory, and a large number of user I/O pins.

This device targets commercial embedded designs that require consolidated programmable logic, substantial embedded RAM, and broad I/O connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• Core Density — 244,188 logic elements supporting complex programmable logic implementations within a single device.
• Embedded Memory — Approximately 12.0 Mbits of on‑chip RAM (12,038,144 total RAM bits) for buffering, lookup tables, and data storage.
• I/O Capability — 612 user I/O pins to enable extensive external connectivity and interface options.
• Power Supply — Operates with a core supply range of 870 mV to 930 mV to support designs targeting this voltage envelope.
• Package & Mounting — 1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High integration density: 244,188 logic elements enable consolidation of complex digital functions into a single FPGA, simplifying system architecture.
• Substantial embedded RAM: Approximately 12.0 Mbits of on‑chip memory reduces dependence on external RAM for many buffering and storage needs.
• Extensive I/O capacity: 612 I/O pins provide flexibility for multiple interfaces and parallel connections without immediate need for additional bridging devices.
• Compact, manufacturable package: 1152‑BBGA FCBGA surface‑mount package facilitates dense PCB layouts and standard assembly processes.
• Commercial temperature rating: Operation from 0 °C to 85 °C aligns with a wide range of commercial applications and deployment environments.

Why Choose EP2AGX260FF35C4G?

The EP2AGX260FF35C4G positions itself as a high‑density, commercially graded FPGA option for designers needing significant on‑chip logic capacity, embedded RAM, and large I/O counts in a compact surface‑mount package. Manufactured by Intel and supplied in a 1152‑BBGA FCBGA package, it fits designs that prioritize consolidation of programmable logic and on‑chip resources while operating within commercial supply and temperature ranges.

For teams developing complex programmable logic-based systems, this device offers a balance of integration, memory capacity, and I/O that supports scalable and maintainable hardware architectures while meeting RoHS environmental requirements.

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