EP2AGX260FF35C5G

The EP2AGX260FF35C5G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 1152-ball BGA surface-mount package. It provides a high count of programmable logic resources and on-chip memory in a compact FCBGA footprint.

With 244,188 logic elements, approximately 12 Mbits of embedded memory, and 612 user I/O pins, this commercial-grade device is designed for designs that require dense logic integration and substantial I/O capacity while operating within a 0 °C to 85 °C temperature range and a supply voltage window of 870 mV to 930 mV.

Key Features

• Programmable Logic Capacity — 244,188 logic elements to implement complex digital designs and custom hardware acceleration.
• Embedded Memory — Approximately 12 Mbits of on-chip RAM (12,038,144 bits) for buffering, LUT-based storage, and state retention within designs.
• I/O Density — 612 user I/O pins to support high-density connectivity and parallel interfacing with external components.
• Package — 1152-ball BGA (FCBGA) package; supplier device package listed as 1152-FBGA (35 × 35) for compact board-level integration and reliable soldered mounting.
• Power Supply — Operates from a core supply range of 870 mV to 930 mV, enabling designs that target this specific voltage window.
• Operating Conditions — Commercial-grade device rated for 0 °C to 85 °C operation, suitable for typical commercial and industrial-adjacent environments.
• Mounting — Surface mount package for automated PCB assembly workflows.
• RoHS Compliance — Device is RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Implement complex state machines and hardware-accelerated logic using the large pool of logic elements and embedded RAM.
• I/O-intensive systems — Support multiple parallel interfaces and external peripherals with 612 user I/O pins for broad connectivity.
• Embedded system integration — Consolidate functions into a single FPGA package for streamlined board layouts and reduced component count.

Unique Advantages

• Substantial logic resources: 244,188 logic elements allow designers to realize complex FPGA-based functions without immediate migration to larger devices.
• On-chip memory capacity: Approximately 12 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching tasks.
• High I/O count: 612 I/Os enable flexible interfacing options for parallel busses, sensor arrays, or multi-channel data paths.
• Compact BGA footprint: 1152-ball FCBGA package offers a balance between board density and thermal/mechanical robustness for surface-mount assembly.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing requirements and broader supply-chain acceptance.

Why Choose EP2AGX260FF35C5G?

The EP2AGX260FF35C5G positions itself as a capable, commercial-grade Arria II GX FPGA option for projects that require a significant amount of programmable logic, embedded memory, and extensive I/O in a single surface-mount package. Its combination of 244,188 logic elements, approximately 12 Mbits of on-chip RAM, and 612 I/Os makes it appropriate for designers consolidating functionality onto an FPGA to reduce component count and optimize board layout.

Engineers and procurement teams seeking a compact FPGA with clear electrical and thermal operating boundaries (870 mV–930 mV core supply, 0 °C–85 °C operating range) will find this device suitable for commercial designs where RoHS compliance and reliable surface-mount packaging are required.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP2AGX260FF35C5G. Our team will provide the details needed to evaluate this FPGA for your next design.