EP2AGX260FF35C6G

The EP2AGX260FF35C6G is an Arria II GX Field Programmable Gate Array (FPGA) from Intel, designed for commercial-grade applications requiring high logic density and extensive I/O. With 244,188 logic elements, approximately 12.04 Mbits of embedded memory, and 612 available I/O pins, this surface-mount FCBGA device delivers a high level of integration in a 1152-BBGA (35×35) package.

Its specified core voltage range and commercial operating temperature make it suitable for a broad range of commercial electronic systems where large on-chip resources and dense packaging are required.

Key Features

• Logic Capacity  244,188 logic elements provide a high level of programmable logic for complex digital designs.
• Embedded Memory  Approximately 12.04 Mbits of on-chip RAM supports local buffering, state storage, and data handling within designs.
• I/O Resources  612 general-purpose I/O pins enable large numbers of external connections for interfacing with peripherals and subsystems.
• Power  Specified supply voltage range of 870 mV to 930 mV supports precise core power planning and design validation.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35); surface-mount mounting for compact board-level integration.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density digital systems  Use where substantial on-chip logic is required to implement complex custom logic and parallel processing.
• I/O-intensive interfaces  Leverage 612 I/O pins for designs that need many external connections, multi-channel aggregation, or extensive sensor and peripheral integration.
• Memory-centric designs  Approximately 12.04 Mbits of embedded memory supports buffering, local data storage, and intermediate processing within FPGA logic.

Unique Advantages

• High integration density: 244,188 logic elements consolidate large amounts of logic into a single device, reducing the need for multiple FPGAs or additional glue logic.
• Generous on-chip RAM: Approximately 12.04 Mbits of embedded memory enables significant local data handling without external RAM components.
• Extensive I/O availability: 612 I/O pins provide flexibility for complex board-level interfaces and parallel connections to external devices.
• Compact FCBGA package: 1152-BBGA (35×35) packaging supports high-density board layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature qualification: Rated for 0 °C to 85 °C operation, aligning with a wide range of commercial electronics deployments.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose EP2AGX260FF35C6G?

The EP2AGX260FF35C6G offers a combination of high logic capacity, substantial embedded memory, and abundant I/O in a compact FCBGA package, making it well suited to commercial designs that require dense, integrated programmable logic. As an Arria II GX device from Intel, it provides a platform for consolidating complex digital functions into a single, surface-mount FPGA.

Its specified voltage range, package density, and commercial operating temperature make it a practical choice for mid- to high-complexity designs where board space, integration, and on-chip resources are primary considerations.

Request a quote or submit an inquiry to obtain pricing and availability for EP2AGX260FF35C6G and to discuss how this Arria II GX FPGA can fit into your next commercial design.