EP2AGX260FF35I3G

The EP2AGX260FF35I3G is an Arria II GX family Field Programmable Gate Array (FPGA) offering high on-chip logic density and abundant I/O in a compact FCBGA package. It delivers 244,188 logic elements and approximately 12.0 Mbits of embedded memory, making it suitable for designs that require substantial programmable logic and on-chip storage.

Configured as a surface-mount device in a 1152-ball FCBGA (35 × 35 mm) package and specified for industrial use, this FPGA supports a supply voltage range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity – 244,188 logic elements provide a high-density programmable fabric for complex logic implementations and partitioned design flows.
• Embedded Memory – Approximately 12.0 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory in many designs.
• I/O Resources – 612 user I/O pins enable broad external interfacing for multi-channel designs and extensive peripheral connectivity.
• Power Supply – Operates with a core supply voltage range of 870 mV to 930 mV, allowing integration into systems with defined low-voltage power rails.
• Package & Mounting – 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35) designed for surface-mount assembly in compact board layouts.
• Industrial Temperature Range – Rated for −40 °C to 100 °C operation to meet environmental demands of industrial applications.
• Regulatory Compliance – RoHS compliant.

Typical Applications

• High-density logic designs – Implement large custom logic functions and complex state machines using 244,188 logic elements.
• I/O-intensive systems – Connect multiple peripherals and interfaces using the device’s 612 user I/O pins for flexible system integration.
• Memory-centric processing – Leverage approximately 12.0 Mbits of embedded memory for buffering, packet handling, or LUT-heavy algorithms.
• Industrial-grade deployments – Deploy in systems that require operation across −40 °C to 100 °C and compliance with RoHS requirements.

Unique Advantages

• High programmable logic density: 244,188 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 12.0 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive external interfacing: 612 I/O pins give design flexibility for multi-interface systems and parallel data paths.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in temperature-demanding environments.
• Compact FCBGA packaging: 1152-ball FCBGA (35 × 35) enables high density on-board integration while supporting surface-mount assembly.
• RoHS compliant: Meets environmental regulatory expectations for lead-free manufacturing.

Why Choose EP2AGX260FF35I3G?

The EP2AGX260FF35I3G positions itself as a high-capacity, industrial-grade FPGA solution that combines a large logic element count, significant embedded memory, and extensive I/O in a compact FCBGA package. It is well suited for designers who need to consolidate complex digital functions into a single programmable device while meeting industrial environmental requirements.

This FPGA is appropriate for engineering teams focused on scalable, robust designs where board-level simplification, on-chip memory, and reliable operation across a wide temperature range are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX260FF35I3G and to discuss how this FPGA can fit into your next design.