EP2AGX260FF35C6N

The EP2AGX260FF35C6N is an Arria II GX field programmable gate array (FPGA) from Intel, designed for high-density programmable logic and system integration. It combines a large logic capacity with substantial embedded memory and abundant I/O to support complex digital designs across communications, compute, and advanced embedded systems.

Packaged in a 1152-ball FCBGA/FBGA footprint, this commercial-grade device targets applications that require significant on-chip resources while operating within a standard commercial temperature range and core voltage window.

Key Features

• High logic capacity — 244,188 logic elements for implementing large-scale digital designs and complex state machines.
• Embedded memory — Approximately 12 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• Generous I/O — 612 user I/O pins to enable extensive external interfacing and high pin-count system connectivity.
• Core supply range — Core voltage specified from 870 mV to 930 mV, enabling predictable power planning for the FPGA core.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• Package and mounting — 1152-BBGA / FCBGA package (supplier: 1152-FBGA (35×35)) in a surface-mount form factor for compact board-level integration.
• Standards compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Communications infrastructure — Use the device’s high logic count and abundant I/O to implement protocol bridging, packet processing, and control-plane logic.
• High-density digital systems — Implement complex custom logic, state machines, and control logic where large programmable fabric and on-chip memory are required.
• Embedded compute and acceleration — Leverage the combination of logic and embedded RAM for algorithm acceleration, pre- and post-processing tasks, and buffering.
• Prototyping and system integration — Suitable for platform prototyping that demands a commercial-grade FPGA with a large resource set and a compact BGA footprint.

Unique Advantages

• Substantial on-chip resources — 244,188 logic elements and approximately 12 Mbits of embedded memory reduce the need for external logic and RAM, simplifying BOM and board layout.
• High external connectivity — 612 I/O pins provide flexibility for multi-channel interfaces and broad peripheral support without requiring external multiplexing logic.
• Compact, surface-mount package — 1152-ball FCBGA/FBGA packaging enables dense system integration in space-constrained designs.
• Predictable power envelope — Core supply range of 870 mV–930 mV supports clear power budgeting for system design and thermal planning.
• Commercial temperature suitability — Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS compliance — Meets common environmental manufacturing requirements for lead-free production.

Why Choose EP2AGX260FF35C6N?

The EP2AGX260FF35C6N positions itself as a high-capacity, commercially graded FPGA for designers who need extensive programmable logic, meaningful on-chip memory, and wide I/O support in a compact BGA package. Its resource set is well suited to demanding digital designs and integration-focused platforms where board space and I/O density matter.

For teams building communication systems, embedded accelerators, or complex prototypes, this Arria II GX device delivers a balanced mix of logic, memory, and connectivity with predictable supply and temperature specifications that simplify system-level planning and integration.

If you would like pricing, availability, or a quote for EP2AGX260FF35C6N, please submit a request or quote through your preferred procurement channel and reference the part number.