EP2AGX260FF35C6

The EP2AGX260FF35C6 is an Arria II GX family FPGA IC from Intel, provided in a 1152‑FBGA (35×35) package for surface‑mount applications. It combines high logic capacity and substantial on‑chip memory with a large I/O count, and is offered as a commercial‑grade device with documented electrical and transceiver characteristics in the Arria II device handbook.

Key Features

• High logic density — 244,188 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded memory — Approximately 12.04 Mbits of on‑chip RAM for buffering, large lookup tables, and state storage.
• Rich I/O — 612 I/O pins to support broad system interfacing and multiple parallel or serial connections.
• Package and mounting — 1152‑FBGA (35×35) package case, surface mount for compact PCB integration.
• Power domain — Core supply voltage range from 870 mV to 930 mV consistent with the device’s documented electrical characteristics.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Transceiver and I/O documentation — Device datasheet and handbook include electrical characteristics and transceiver performance specifications for system design and validation.
• RoHS compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High‑speed serial interfaces — Use where documented transceiver performance and programmable I/O timing are required for serial link integration.
• Compute and logic acceleration — Large logic element count and embedded RAM enable implementation of custom acceleration blocks and complex state machines.
• System prototyping and integration — Surface‑mount FBGA package and abundant I/O make the device suitable for compact prototype and production boards requiring flexible I/O mapping.

Unique Advantages

• Substantial programmable capacity: 244,188 logic elements provide space for sizeable custom logic and multi‑function designs.
• Significant on‑chip memory: Approximately 12.04 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Large I/O complement: 612 I/O pins allow flexible interfacing to peripherals, memory buses, and multi‑lane connectivity.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.
• Well‑documented electricals: Arria II device handbook and device datasheet provide detailed electrical and transceiver specifications to support design validation.

Why Choose EP2AGX260FF35C6?

The EP2AGX260FF35C6 positions itself as a high‑capacity programmable logic device for commercial applications that require significant logic resources, on‑chip memory, and a large number of I/O channels. Its documented electrical and transceiver characteristics in the Arria II device handbook support system‑level design and integration. The 1152‑FBGA surface‑mount package provides a compact footprint for board‑level deployment while meeting RoHS requirements.

This device is suited to teams designing complex FPGA‑based subsystems who need verified electrical data and sizeable programmable resources backed by Intel’s Arria II documentation.

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