EP2AGX260FF35C5

The EP2AGX260FF35C5 is an Arria II GX family FPGA from Intel, provided in a high‑pin‑count FCBGA package. It delivers large logic capacity, substantial embedded memory, and a high I/O count for complex, board‑level digital designs.

Targeted at commercial applications, the device is documented in the Arria II device handbook and datasheet, which include detailed electrical, transceiver, and I/O timing specifications for system integration and performance scaling.

Key Features

• High Logic Capacity  244,188 logic elements provide wide scope for implementing complex digital functions and large custom logic designs.
• Embedded Memory  Approximately 12.04 Mbits of on‑chip RAM (12,038,144 bits) for buffering, FIFOs, and on‑chip data storage.
• PLLs and Transceiver Documentation  Device handbook contains transceiver performance specifications, programmable I/O element delay, and output buffer timing for high‑speed interfaces.
• Large I/O Count  612 user I/O pins support extensive external interfacing and multi‑bank connectivity on complex PCBs.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to align with system power budgeting and core performance requirements.
• Package and Mounting  1152‑BBGA (FCBGA) / 1152‑FBGA (35×35) package optimized for surface‑mount assembly and high‑pin density routing.
• Commercial Grade Operating Range  Rated for 0 °C to 85 °C operation and specified as a commercial‑grade device.
• RoHS Compliant  Meets RoHS requirements for lead‑free manufacturing and assembly processes.

Typical Applications

• High‑density digital processing  Use the device’s large logic element count and embedded memory to implement complex signal processing, protocol stacks, or hardware acceleration blocks.
• High‑I/O system integration  With 612 I/O pins and a compact FCBGA package, integrate multiple peripherals and external devices on a single PCB footprint.
• High‑speed interface designs  Designs that require transceiver and I/O timing control can leverage the documented Arria II device handbook specifications for transceivers and programmable I/O delays.
• Prototyping and production for commercial products  Commercial temperature rating and surface‑mount BGA packaging make this device suitable for volume commercial deployments within the 0 °C to 85 °C range.

Unique Advantages

• Highly integrated logic and memory: Combines 244,188 logic elements with ~12.04 Mbits of embedded RAM to reduce external memory dependencies.
• Extensive I/O capacity: 612 I/O pins enable rich external connectivity without multiple interface expanders.
• Compact, high‑pin package: 1152‑pin FCBGA (35×35) delivers high routing density in a surface‑mount form factor.
• Documented transceiver and I/O timing: Arria II device handbook provides the electrical and switching characteristics needed for reliable high‑speed interface design.
• Commercial temperature and RoHS compliance: Clear specification for 0 °C to 85 °C operation and lead‑free manufacturing compliance.
• Controlled core voltage range: Defined 870 mV–930 mV supply simplifies power‑rail planning for core logic.

Why Choose EP2AGX260FF35C5?

EP2AGX260FF35C5 offers a solid combination of large logic capacity, multi‑Mbit embedded memory, and a high I/O count in a compact 1152‑pin FCBGA package, making it well suited for commercial designs that require substantial on‑chip resources and dense board integration. Its documented electrical and transceiver characteristics in the Arria II device handbook support informed system design and timing closure.

Choose this device when you need a commercially rated FPGA with a balance of logic density, embedded memory, and extensive I/O for complex digital systems and high‑speed interface implementations.

Request a quote or submit an RFQ for EP2AGX260FF35C5 to receive pricing and availability information for your design or production needs.