EP2AGX260EF29I5N

The EP2AGX260EF29I5N is an Arria II GX family FPGA in an industrial-grade, surface-mount 780‑FBGA (29×29) package. It provides a high-density programmable fabric with 244,188 logic elements and abundant I/O to support complex, configurable digital designs.

Designed for applications that require large on-chip memory and flexible interfacing, this device delivers approximately 12 Mbits of embedded memory, 372 user I/Os, and industrial operating range for reliable operation across broad environmental conditions.

Key Features

• High-density logic: 244,188 logic elements (cells) to implement complex digital functions and large-scale FPGA designs.
• Embedded memory: Approximately 12 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory.
• Extensive I/O: 372 user I/O pins for wide peripheral and interface connectivity across multiple banks.
• Industrial-grade temperature range: Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
• Low-voltage core supply: Core voltage supply range of 870 mV to 930 mV for the programmable fabric and on-chip logic.
• Package and mounting: Surface-mount 780‑FBGA (29×29) package (780‑BBGA, FCBGA case) suitable for compact, high-density board layouts.
• Regulatory compliance: RoHS compliant.
• Arria II GX family documentation: Device series handbook and datasheet provide electrical, transceiver, and I/O timing specifications for system design and validation.

Typical Applications

• High-speed communications: High logic density, embedded memory, and transceiver-focused documentation in the Arria II GX family make this device suitable for designs requiring robust serial and protocol handling.
• Industrial control systems: Industrial-grade temperature range and extensive I/O count support automation, motor control, and factory instrumentation applications.
• Embedded acceleration and processing: Large logic and on-chip RAM provide the resources needed for data-path acceleration, signal conditioning, and custom processing blocks.

Unique Advantages

• Large programmable fabric: 244,188 logic elements reduce the need for multiple devices and simplify complex system integration.
• Significant on-chip memory: Approximately 12 Mbits of embedded RAM minimizes external memory dependency for many buffering and lookup tasks.
• Broad I/O capability: 372 I/Os enable flexible interfacing with sensors, processors, and high-speed peripherals.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact, assembly-ready package: 780‑FBGA (29×29) surface-mount package supports high-density PCB designs while maintaining manufacturability.
• Standards-conscious supply: RoHS compliance aids environmental and regulatory planning.

Why Choose EP2AGX260EF29I5N?

The EP2AGX260EF29I5N positions itself as a high-density, industrial-grade FPGA solution within the Arria II GX family, combining substantial logic capacity, significant embedded memory, and a large I/O complement in a single 780‑FBGA package. Its specified core voltage range and documented device characteristics support engineers who need predictable electrical and thermal behavior.

This device is well suited to teams building complex, high-performance embedded systems, communications modules, and industrial controls that benefit from programmable flexibility, on-chip resources, and a design supported by the Arria II family documentation.

Request a quote or submit an inquiry for pricing and availability to begin integrating the EP2AGX260EF29I5N into your next-generation design.