EP2AGX260FF35C4N

The EP2AGX260FF35C4N is an Arria II GX family FPGA offering high logic density and extensive I/O in a compact FCBGA package. It combines 244,188 logic elements with substantial on-chip RAM and a 612-pin I/O footprint to support complex, high-integration designs.

Designed for applications that require large programmable logic capacity, embedded memory, and dense board-level connectivity, this commercial-grade device is suited to system designs operating within a 0 °C to 85 °C range and a core supply window of 870 mV to 930 mV.

Key Features

• High logic capacity — 244,188 logic elements to implement large-scale programmable logic and complex control functions.
• Embedded memory — Total on-chip RAM of 12,038,144 bits (approximately 11.5 Mbits) to reduce external memory dependencies.
• Extensive I/O — 612 I/O pins for high-density interfacing and flexible board-level integration.
• Package and mounting — 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount assembly.
• Core power — Operating supply voltage range from 870 mV to 930 mV for the device core.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation; RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex logic, state machines, and datapaths using the device’s 244,188 logic elements and embedded RAM.
• I/O-intensive systems — Leverage 612 I/O pins for multi-protocol interfaces, board-level integration, and signal routing.
• Prototyping and system integration — Use the compact 1152-FBGA (35×35) package for dense PCB designs where footprint and connectivity matter.

Unique Advantages

• Significant programmable capacity: 244,188 logic elements enable consolidation of multiple functions into a single FPGA.
• Substantial on-chip RAM: Approximately 11.5 Mbits of embedded memory reduces reliance on external memory and simplifies board design.
• High I/O density: 612 I/O pins provide flexibility for interfacing with multiple peripherals and high-channel-count systems.
• Space-efficient packaging: 1152-FBGA (35×35) surface-mount package supports compact, high-density PCB layouts.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.
• Controlled core power window: Core supply range of 870 mV to 930 mV supports predictable power planning.

Why Choose EP2AGX260FF35C4N?

The EP2AGX260FF35C4N positions itself as a high-capacity Arria II GX FPGA for designers who need extensive programmable logic, sizable on-chip RAM, and a large number of I/O in a compact FCBGA footprint. Its combination of logic elements, embedded memory, and 612 I/O makes it suitable for demanding integration tasks where consolidation and board-level connectivity are priorities.

This part is appropriate for commercial applications operating within the specified 0 °C to 85 °C temperature range and core voltage window. Technical specifications and device characteristics are documented in the Arria II device handbook and device datasheet for engineering evaluation and system design planning.

Request a quote or submit an inquiry today to check availability, lead time, and pricing for the EP2AGX260FF35C4N. Our team can provide procurement details and assist with design-in considerations.