EP2AGX260FF35C4

The EP2AGX260FF35C4 is an Intel Arria II GX field-programmable gate array (FPGA) in a 1152‑BBGA FCBGA package intended for commercial applications. The device integrates a large programmable fabric—244,188 logic elements—and approximately 12.04 Mbits of on-chip RAM, combined with 612 user I/O pins to support dense, memory‑rich logic designs.

Designed for surface-mount implementation and RoHS compliant, this commercial‑grade FPGA operates over a 0 °C to 85 °C range with a specified core supply window of 870 mV to 930 mV.

Key Features

• Logic Capacity  244,188 logic elements provide substantial programmable resource for complex digital designs.
• Embedded Memory  Approximately 12.04 Mbits of on-chip RAM for buffering, look‑up tables, and state storage.
• I/O Density  612 user I/O pins to support broad interfacing needs and multi‑bank connectivity.
• Package & Mounting  1152‑BBGA FCBGA package (supplier device package: 1152‑FBGA, 35x35) optimized for surface‑mount assembly.
• Power  Specified core supply range of 870 mV to 930 mV to match system power-rail planning.
• Thermal & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High‑density digital processing  Use the large logic capacity and on-chip RAM for complex protocol handling, data manipulation, and custom processing pipelines.
• Telecommunications and networking  Leverage abundant I/O and embedded memory for packet buffering, packet processing blocks, and interface aggregation.
• Prototyping and programmable logic integration  Surface-mount FCBGA packaging and comprehensive programmable fabric make the device suitable for system prototyping and integration into production boards.

Unique Advantages

• Substantial programmable resources: 244,188 logic elements enable implementation of large, partitioned designs without external logic expansion.
• Ample embedded memory: Approximately 12.04 Mbits of on-chip RAM reduces dependence on external memory for many buffering and stateful functions.
• Extensive I/O capability: 612 I/O pins permit flexible interfacing and multiple high-pin-count connections on a single device.
• Compact, production-ready package: 1152‑BBGA (1152‑FBGA, 35x35) surface-mount package supports high‑density board designs and automated assembly.
• Commercial temperature rating: Operation across 0 °C to 85 °C fits a wide range of industrial and consumer electronics deployments where commercial grade is required.
• Regulatory alignment: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose EP2AGX260FF35C4?

The EP2AGX260FF35C4 combines a large logic fabric with substantial embedded memory and high I/O density in a compact FCBGA footprint, making it a practical choice for designers needing significant on-chip resources in a commercial‑grade FPGA. Its defined core supply range and documented operating conditions support predictable power budgeting and thermal planning.

This device suits engineers and procurement teams working on complex digital systems that require integrated logic capacity, embedded RAM, and flexible I/O within a surface‑mount package backed by Intel's Arria II GX device documentation.

Request a quote or submit an inquiry for pricing and availability to begin integrating the EP2AGX260FF35C4 into your next design.