EP2AGX260EF29I5

The EP2AGX260EF29I5 is an industrial-grade Arria II GX Field Programmable Gate Array (FPGA) from Intel, designed for high-density logic integration and flexible I/O implementation. It combines a large logic fabric with embedded memory and abundant I/O, making it suitable for demanding industrial and embedded designs that require significant on-chip resources and robust operating range.

Key value comes from its large logic capacity, approximately 12.04 Mbits of embedded RAM, and 372 I/O pins in a compact surface-mount FCBGA package — enabling complex custom logic, buffering, and interfacing in space-constrained assemblies.

Key Features

• Logic Capacity — 244,188 logic elements provide substantial programmable logic resources for complex state machines, data-paths, and custom accelerators.
• Embedded Memory — Approximately 12.04 Mbits of on-chip RAM for intermediate buffering, FIFOs, and local lookup tables to reduce external memory dependence.
• I/O Density — 372 I/O pins enable extensive peripheral and high-pin-count interfacing without external multiplexing.
• Package & Mounting — 780‑BBGA (FCBGA) with supplier device package 780‑FBGA (29×29) in a surface-mount format for compact board-level integration.
• Power Supply — Core voltage operation specified between 870 mV and 930 mV to match board power-rail design targets.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Regulatory Compliance — RoHS compliant for global electronic manufacturing and assembly processes.

Typical Applications

• Industrial Control & Automation — Leverage the device’s large logic and memory resources to implement custom motor control, sequencing, and deterministic IO aggregation in industrial systems.
• Data Acquisition & Signal Processing — Use the abundant logic and on-chip RAM for real-time filtering, buffering, and preprocessing of sensor data prior to downstream processing.
• High-density I/O Bridging — Implement protocol bridging, bus aggregation, and parallel interface handling where 372 I/Os and on-chip memory reduce external component count.
• Prototyping & Custom FPGA Acceleration — Suitable for developers building and validating complex logic functions that require sizable programmable fabric and embedded RAM.

Unique Advantages

• Substantial On-chip Logic: 244,188 logic elements enable large-scale custom logic implementations without immediate reliance on external programmable devices.
• Significant Embedded Memory: Approximately 12.04 Mbits of RAM supports local buffering and state storage, simplifying board-level memory architectures.
• High I/O Count: 372 I/Os allow direct interfacing to numerous peripherals and external devices, reducing the need for external I/O expanders.
• Industrial-grade Robustness: Specified for −40 °C to 100 °C operation, making it suitable for a wide range of industrial deployments.
• Compact FCBGA Packaging: 780‑FBGA (29×29) surface-mount package balances high pin count with a compact board footprint for space-constrained designs.
• RoHS Compliance: Meets environmental restrictions for contemporary manufacturing and supply chains.

Why Choose EP2AGX260EF29I5?

The EP2AGX260EF29I5 positions itself as a high-density, industrial-grade FPGA option for designs that require a large programmable fabric, meaningful on-chip memory, and a high I/O count in a compact FCBGA package. Its specified voltage and temperature range support reliable integration into industrial and embedded systems where operating margins and environmental durability matter.

Engineers and procurement teams looking to minimize external components while retaining flexible, reconfigurable logic capacity will find this device well-suited for scalable prototypes and production designs that demand substantial on-chip resources and industrial-temperature operation.

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