EP2AGX260EF29C6N

The EP2AGX260EF29C6N is an Intel Arria II GX Field Programmable Gate Array supplied in a 780-BBGA (29×29) FCBGA package for surface-mount assembly. This commercial-grade FPGA combines high logic capacity, substantial on-chip RAM, and a large I/O complement to serve designs that require dense programmable logic and embedded memory.

Its architecture and package deliver a compact, high-pin-count solution for complex programmable-logic designs in commercial-temperature applications, with core supply and operating conditions specified for reliable integration.

Key Features

• High Logic Capacity — 244,188 logic elements provide significant programmable resources for complex designs and dense logic implementations.
• Embedded Memory — Approximately 12.0 Mbits of on-chip RAM (12,038,144 bits) for buffering, packet storage, and block memory needs without external devices.
• I/O Resources — 372 I/O pins to support wide parallel interfaces, multiple banks, and high pin-count connectivity.
• Package and Mounting — 780-BBGA, FCBGA (supplier package: 780-FBGA, 29×29) in a surface-mount form factor for compact board integration.
• Power — Core voltage supply specified from 870 mV to 930 mV, enabling defined power integration into system designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for use in commercial temperature environments.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and regulatory considerations.

Typical Applications

• High-density logic and prototyping — Use the large logic-element count and embedded RAM to implement complex algorithms and hardware prototypes on a single device.
• Multi-I/O system interfacing — The 372 I/Os enable integration of numerous parallel and serial interfaces for data aggregation and system glue logic.
• Compact, high-pin-count designs — The 780-FBGA (29×29) package provides a space-efficient solution for boards requiring many I/O connections in a surface-mount footprint.
• Commercial-product programmable logic — Suited to commercial-temperature applications where on-chip memory and logic density simplify system design.

Unique Advantages

• High logic density: 244,188 logic elements enable large, integrated logic functions without partitioning across multiple devices.
• Substantial embedded memory: Approximately 12.0 Mbits of on-chip RAM reduces dependence on external memory and improves data-path performance.
• Large I/O complement: 372 I/Os support complex interfacing requirements and flexible I/O bank configurations.
• Compact, high-pin-count package: 780-BBGA (29×29) FCBGA combines high pin count with a surface-mount package for dense PCB layouts.
• Defined power envelope: Core supply range of 870–930 mV provides clear parameters for power-supply design and system integration.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for commercial production environments.

Why Choose EP2AGX260EF29C6N?

The EP2AGX260EF29C6N positions itself as a high-density, commercially rated Arria II GX FPGA that brings together large programmable logic resources, meaningful on-chip RAM, and an extensive I/O set in a compact 780-FBGA surface-mount package. It is well suited for engineering teams seeking to consolidate logic and memory functions into a single device for commercial-temperature applications.

With clearly specified core voltage and operating-temperature limits, this device supports predictable system integration and helps streamline board-level design where high logic capacity and a high I/O count are essential.

Request a quote or submit a parts inquiry to check availability and pricing for the EP2AGX260EF29C6N for your next project.