EP2AGX260EF29C5G

The EP2AGX260EF29C5G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers a high-density logic fabric with substantial on-chip memory and a large I/O count for complex, configurable hardware designs.

Targeted at commercial-grade applications, this device supports designs that require extensive programmable logic, approximately 12.0 Mbits of embedded memory, and up to 372 user I/O pins while operating within a 0 °C to 85 °C temperature range and a core supply window of 870 mV to 930 mV.

Key Features

• Logic Capacity  244,188 logic elements for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 12.0 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing without external DRAM for some functions.
• I/O Resources  372 user I/O pins to accommodate high-pin-count peripheral and interface requirements.
• Power Supply  Core voltage support from 870 mV to 930 mV, enabling designers to target specific power domains and supply schemes.
• Package and Mounting  780-ball FCBGA (29 × 29) package, surface-mount assembly for compact board integration.
• Operating Conditions  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Implement complex logic functions and custom datapaths using the device's 244,188 logic elements and embedded memory.
• Interface aggregation  Support multi-protocol or high-pin-count I/O requirements with 372 user I/Os for bridging and glue logic roles.
• On-chip buffering and packet processing  Leverage approximately 12.0 Mbits of embedded RAM for buffering, FIFOs, and memory-backed state machines.
• Compact system integration  780-ball FCBGA package enables dense PCB layouts where board space and pin count are primary constraints.

Unique Advantages

• High logic density: 244,188 logic elements enable substantial on-chip implementation of custom hardware and parallel processing.
• Significant embedded memory: Approximately 12.0 Mbits of RAM reduces reliance on external memory for many buffering and caching needs.
• Large I/O complement: 372 user I/O pins simplify connections to multiple peripherals and high-bandwidth interfaces.
• Compact FCBGA package: 780-ball, 29 × 29 FCBGA supports high-density board designs while maintaining robust signal routing options.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for standard commercial environments and applications.
• RoHS compliant: Meets common environmental regulatory requirements for lead-free assemblies.

Why Choose EP2AGX260EF29C5G?

The EP2AGX260EF29C5G positions itself as a high-capacity, commercially rated FPGA option for engineers who need a combination of extensive logic resources, on-chip memory, and a large I/O count in a compact FCBGA package. Its specification set supports integration of complex, configurable hardware functions where board area, pin count, and embedded memory are important design considerations.

This device is appropriate for teams developing commercial electronic systems that require scalable programmable logic, substantial on-chip RAM, and the routing density afforded by a 780-ball FCBGA package. Manufacturer documentation is available for detailed integration and electrical guidance.

Request a quote or submit a procurement inquiry to obtain pricing, lead times, and availability for the EP2AGX260EF29C5G.