EP2AGX260EF29C5

The EP2AGX260EF29C5 is an Arria II GX FPGA in a 780-BBGA (FCBGA) package designed for commercial embedded and communications applications. It provides a large programmable fabric with 244,188 logic elements and substantial on-chip memory to implement complex logic, protocol stacks, and data-path functions.

This device combines a high-pin-count 372 I/O interface and surface-mount 780-FBGA (29×29) packaging with an operating core supply of 0.87–0.93 V and a commercial temperature rating of 0 °C to 85 °C, making it suitable for dense, board-level integration in commercial products.

Key Features

• Large logic capacity — 244,188 logic elements for implementing complex state machines, glue logic, and large-scale programmable functions.
• Embedded memory — Approximately 12.04 Mbits of on-chip RAM to support buffering, frame storage, and algorithmic state.
• I/O density — 372 general-purpose I/O pins to consolidate interfaces and connect to multiple external peripherals or memory devices.
• Package and mounting — 780-BBGA (FCBGA) supplier package, 780-FBGA (29×29) footprint; surface-mount mounting type for compact, high-density PCB designs.
• Power requirements — Operating core supply 0.87–0.93 V; datasheet identifies absolute maximum supply conditions for system design margining.
• Programmable I/O and timing — Device family documentation specifies programmable I/O element (IOE) delay and programmable output buffer delay for fine-grained timing control.
• Commercial grade — Rated for commercial temperature operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• High-speed communications — On-chip transceiver and large logic/memory resources enable protocol implementation and packet processing for communication equipment.
• Embedded processing and control — Large logic capacity and embedded RAM support complex control systems, custom accelerators, and hardware offload engines in commercial products.
• Multi-interface bridging — 372 I/Os allow aggregation and protocol conversion between multiple external interfaces and subsystems on a single device.

Unique Advantages

• High integration density: 244,188 logic elements and ~12.04 Mbits of embedded RAM reduce board count and simplify system design by consolidating logic and memory on-chip.
• Flexible I/O count: 372 I/Os enable direct connection to a wide variety of peripherals and parallel buses without extensive external glue logic.
• Compact high-pin package: 780-BBGA (FCBGA) in a 29×29 supplier package supports high-density PCB layouts while maintaining robust electrical and thermal characteristics for commercial designs.
• Design-level timing control: Programmable IOE and output buffer delays (documented in the device handbook) allow precise timing adjustments to meet system timing requirements.
• Regulatory and manufacturing readiness: RoHS compliance and standard commercial temperature rating support broad manufacturing and regulatory requirements for commercial products.

Why Choose EP2AGX260EF29C5?

The EP2AGX260EF29C5 positions itself as a high-capacity, commercially rated Arria II GX FPGA suitable for designers who need substantial programmable logic, embedded memory, and a large I/O complement in a compact FCBGA footprint. Its combination of nearly quarter-million logic elements, multi-megabit on-chip RAM, and programmable I/O timing makes it well suited to dense system designs that demand integration of multiple functions on a single device.

For customers targeting commercial embedded systems and communications equipment, this device offers a balance of integration, configurability, and board-level density—backed by the Arria II device family documentation for electrical characteristics, transceiver performance, and timing control.

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