EP2AGX260EF29C6

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA

Quantity 139 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs10260Number of Logic Elements/Cells244188
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12038144

Overview of EP2AGX260EF29C6 – Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA

The EP2AGX260EF29C6 is an Arria II GX field programmable gate array (FPGA) manufactured by Intel. It provides a high-density programmable fabric with a substantial logic resource set and embedded memory, packaged in a 780-ball FCBGA (29 × 29) surface-mount package for compact system integration.

This commercial-grade device targets applications that require large logic capacity, significant on-chip RAM, and a high I/O count while operating within a 0 °C to 85 °C ambient range and a documented core supply range of 870 mV to 930 mV.

Key Features

  • Logic Capacity  Approximately 244,188 logic elements for implementing complex custom logic and parallel processing functions.
  • Logic Array Blocks  10,260 logic array blocks (LABs) to organize logic resources for modular and scalable design implementation.
  • Embedded Memory  Approximately 12.0 Mbits of on-chip RAM for high-bandwidth, low-latency storage of data and state.
  • I/O Resources  372 I/O pins to support diverse interfacing requirements across multiple banks and external peripherals.
  • Package & Mounting  780-ball BGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly.
  • Power Supply  Core voltage specified from 870 mV to 930 mV, aligning device operation to defined electrical characteristics.
  • Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Device Documentation  Device handbook and datasheet detail electrical characteristics, transceiver performance specifications, programmable I/O element (IOE) delay, and programmable output buffer delay for design and timing analysis.
  • RoHS Compliance  RoHS-compliant device suitable for regions and applications requiring restricted substance compliance.

Typical Applications

  • High-performance digital systems  Implement complex custom logic, signal processing pipelines, and control functions using the device's large logic element count and embedded memory.
  • Multi-interface controllers  Leverage 372 I/Os to aggregate and bridge multiple external interfaces and peripherals in a single FPGA-based controller.
  • Prototyping and FPGA-based acceleration  Use the Arria II GX fabric and on-chip RAM to prototype ASIC-bound logic or accelerate compute tasks where reconfigurable hardware is required.

Unique Advantages

  • High logic density: Approximately 244,188 logic elements and 10,260 logic array blocks enable implementation of large, gate-rich designs without external logic expansion.
  • Significant embedded memory: ~12.0 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs, improving system latency.
  • Extensive I/O capability: 372 I/Os provide flexible interfacing options for complex systems that require many external connections.
  • Compact surface-mount package: 780-ball FCBGA (29×29) package supports dense PCB layouts and reliable surface-mount assembly.
  • Documented timing and transceiver details: Device handbook includes programmable I/O and output buffer delay information plus transceiver/periphery specifications to support timing closure and signal integrity planning.
  • Regulatory readiness: RoHS compliance supports deployment in environments where restricted substance compliance is required.

Why Choose EP2AGX260EF29C6?

The EP2AGX260EF29C6 Arria II GX FPGA combines high logic capacity, substantial embedded memory, and a large I/O complement in a compact 780-ball FCBGA surface-mount package. Its documented electrical characteristics and device handbook coverage make it suitable for designers who need verifiable device behavior for timing, power, and transceiver considerations.

This commercial-grade device is appropriate for development and deployment in systems that operate within 0 °C to 85 °C and require a well-documented, high-density programmable platform for complex digital functions and multi-interface integration.

Request a quote or submit a product inquiry to get pricing and availability for the EP2AGX260EF29C6 Arria II GX FPGA. Our team will provide the information you need to evaluate this device for your design.

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