EP2AGX260EF29C6
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA |
|---|---|
| Quantity | 139 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10260 | Number of Logic Elements/Cells | 244188 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12038144 |
Overview of EP2AGX260EF29C6 – Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA
The EP2AGX260EF29C6 is an Arria II GX field programmable gate array (FPGA) manufactured by Intel. It provides a high-density programmable fabric with a substantial logic resource set and embedded memory, packaged in a 780-ball FCBGA (29 × 29) surface-mount package for compact system integration.
This commercial-grade device targets applications that require large logic capacity, significant on-chip RAM, and a high I/O count while operating within a 0 °C to 85 °C ambient range and a documented core supply range of 870 mV to 930 mV.
Key Features
- Logic Capacity Approximately 244,188 logic elements for implementing complex custom logic and parallel processing functions.
- Logic Array Blocks 10,260 logic array blocks (LABs) to organize logic resources for modular and scalable design implementation.
- Embedded Memory Approximately 12.0 Mbits of on-chip RAM for high-bandwidth, low-latency storage of data and state.
- I/O Resources 372 I/O pins to support diverse interfacing requirements across multiple banks and external peripherals.
- Package & Mounting 780-ball BGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly.
- Power Supply Core voltage specified from 870 mV to 930 mV, aligning device operation to defined electrical characteristics.
- Operating Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Device Documentation Device handbook and datasheet detail electrical characteristics, transceiver performance specifications, programmable I/O element (IOE) delay, and programmable output buffer delay for design and timing analysis.
- RoHS Compliance RoHS-compliant device suitable for regions and applications requiring restricted substance compliance.
Typical Applications
- High-performance digital systems Implement complex custom logic, signal processing pipelines, and control functions using the device's large logic element count and embedded memory.
- Multi-interface controllers Leverage 372 I/Os to aggregate and bridge multiple external interfaces and peripherals in a single FPGA-based controller.
- Prototyping and FPGA-based acceleration Use the Arria II GX fabric and on-chip RAM to prototype ASIC-bound logic or accelerate compute tasks where reconfigurable hardware is required.
Unique Advantages
- High logic density: Approximately 244,188 logic elements and 10,260 logic array blocks enable implementation of large, gate-rich designs without external logic expansion.
- Significant embedded memory: ~12.0 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs, improving system latency.
- Extensive I/O capability: 372 I/Os provide flexible interfacing options for complex systems that require many external connections.
- Compact surface-mount package: 780-ball FCBGA (29×29) package supports dense PCB layouts and reliable surface-mount assembly.
- Documented timing and transceiver details: Device handbook includes programmable I/O and output buffer delay information plus transceiver/periphery specifications to support timing closure and signal integrity planning.
- Regulatory readiness: RoHS compliance supports deployment in environments where restricted substance compliance is required.
Why Choose EP2AGX260EF29C6?
The EP2AGX260EF29C6 Arria II GX FPGA combines high logic capacity, substantial embedded memory, and a large I/O complement in a compact 780-ball FCBGA surface-mount package. Its documented electrical characteristics and device handbook coverage make it suitable for designers who need verifiable device behavior for timing, power, and transceiver considerations.
This commercial-grade device is appropriate for development and deployment in systems that operate within 0 °C to 85 °C and require a well-documented, high-density programmable platform for complex digital functions and multi-interface integration.
Request a quote or submit a product inquiry to get pricing and availability for the EP2AGX260EF29C6 Arria II GX FPGA. Our team will provide the information you need to evaluate this device for your design.

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