EP2AGX260EF29C4N

The EP2AGX260EF29C4N is a commercial-grade Arria II GX field programmable gate array (FPGA) manufactured by Intel. It provides a high-density programmable fabric suitable for designs that require substantial logic resources, embedded memory, and a large number of I/O connections.

Designed for applications that demand integration of logic and on-chip memory, this device offers a balance of logic capacity, embedded RAM, and I/O count in a 780-BBGA (780-FBGA, 29×29) surface-mount package, with documented operating and electrical characteristics in the Arria II device handbook.

Key Features

• Core Logic  Approximately 244,188 logic elements, providing substantial capacity for complex programmable logic implementations.
• Logic Structure  10,260 LABs/CLBs equivalent logic grouping as documented for the device family.
• Embedded Memory  Approximately 12.0 Mbits of embedded memory (total RAM bits: 12,038,144) to support data buffering, FIFOs, and on-chip storage.
• I/O Count  372 user I/O pins to support multiple interfaces and high-pin-count system requirements.
• Package  780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount format for board-level integration.
• Power Supply  Core voltage supply range: 870 mV to 930 mV, enabling defined power budgeting for the programmable core.
• Operating Range  Commercial-grade operating temperature range: 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.
• Device Family Documentation  Arria II device handbook and device datasheet detail electrical characteristics, transceiver performance specifications, and I/O timing for the Arria II GX family.

Typical Applications

• High-density FPGA designs  Use the large logic element count and LAB/CLB structure to implement complex control, datapath, and state-machine logic.
• On-chip memory‑intensive functions  Leverage approximately 12.0 Mbits of embedded RAM for buffering, packet processing, and local data storage.
• Multi‑interface systems  Deploy in boards requiring many I/Os—372 I/O pins facilitate connectivity to peripherals, interfaces, and daughter cards.
• Board-level integration  The 780-FBGA (29×29) surface-mount package supports compact, high-pin-count PCB designs where board real estate and routing are considerations.

Unique Advantages

• High logic capacity:  Approximately 244,188 logic elements allow implementation of large-scale programmable designs without immediate partitioning to multiple devices.
• Substantial on-chip memory:  Approximately 12.0 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O availability:  372 I/Os provide flexibility for mixed-signal front ends, parallel busses, and multiple peripheral interfaces.
• Compact, high-pin-count package:  780-FBGA (29×29) brings a high number of signals to the PCB in a compact footprint suitable for dense system designs.
• Commercial operating profile:  Rated for 0 °C to 85 °C and RoHS compliance, aligning with standard commercial product requirements.
• Documented device family characteristics:  Electrical, switching, and I/O timing characteristics for the Arria II GX family are available in the device handbook for design reference.

Why Choose EP2AGX260EF29C4N?

The EP2AGX260EF29C4N delivers a high-capacity, commercially rated Arria II GX FPGA in a 780-FBGA surface-mount package. With approximately 244,188 logic elements, roughly 12.0 Mbits of embedded RAM, and 372 I/Os, it is positioned for designs that require substantial on-chip resources and flexible I/O connectivity while maintaining commercial temperature and RoHS compliance.

This device suits engineering teams and procurement professionals targeting dense programmable logic implementations that rely on documented Arria II GX electrical and timing specifications for system integration and validation.

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