EP2AGX190FF35I5N

The EP2AGX190FF35I5N is an Arria II GX FPGA from Intel, delivered in an industrial-grade speed and temperature offering. It integrates a large programmable fabric with high I/O density and significant embedded memory, designed for systems that require flexible hardware acceleration and complex logic integration.

Built on the Arria II GX device family, the device datasheet documents transceiver performance, PCI Express (PIPE) (PCIe) HIP block support and comprehensive I/O timing features, making it suitable for designs that depend on high-speed serial interfaces and precise I/O control.

Key Features

• Logic Capacity  Provides 181,165 logic elements for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory  Approximately 10.18 Mbits of on-chip RAM to support buffering, packet processing, and state storage within the FPGA fabric.
• I/O Density  612 user I/Os to support wide parallel interfaces, multiple peripherals, or multi-lane serial arrangements.
• Transceiver and High-Speed Interfaces  Datasheet includes transceiver performance specifications and references to a PCI Express (PIPE) (PCIe) HIP block, enabling high-speed serial link implementations.
• Core Power Range  Core voltage supply specified between 870 mV and 930 mV for optimized core power delivery.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting  1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact board integration and high pin count routing.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑speed serial interfaces  Use the device’s documented transceiver specifications and PCIe HIP block for implementing high-speed link endpoints and protocol bridging.
• Industrial control and automation  Industrial-grade temperature range and robust I/O count make the device suitable for control, monitoring, and signal aggregation in industrial systems.
• Embedded acceleration  Large logic element count and on-chip RAM enable hardware acceleration for signal processing, custom datapaths, and protocol offload tasks.

Unique Advantages

• High integration density: Large logic fabric and substantial embedded memory reduce external component count for complex designs.
• Extensive I/O headroom: 612 I/Os allow flexible interfacing with sensors, memory, SERDES lanes, and parallel buses without immediate need for expanded I/O chips.
• Industrial robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Compact, high‑pin package: 1152-FBGA (35×35) delivers high routing density in a surface-mount form factor suitable for space-constrained PCBs.
• Power-focused core specification: Narrow core voltage supply range (870 mV–930 mV) enables focused power delivery design and predictable core operating conditions.
• Documented high-speed feature set: Arria II GX family datasheet coverage of transceivers, PCIe HIP, and I/O timing supports system-level engineering and verification.

Why Choose EP2AGX190FF35I5N?

The EP2AGX190FF35I5N positions itself as a high-capacity Arria II GX FPGA option for engineers needing a combination of abundant logic resources, substantial on-chip memory, and high I/O count within an industrial temperature envelope. Its package and documented high-speed interface features align with applications requiring compact board integration and rigorous I/O and serial-link design.

Supported by Arria II GX device documentation, this device is appropriate for development teams focused on scalable hardware acceleration, complex protocol implementation, and industrial deployments where temperature range and I/O flexibility are key selection criteria.

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