EP2AGX260EF29I3N
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 12038144 244188 780-BBGA, FCBGA |
|---|---|
| Quantity | 640 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 10260 | Number of Logic Elements/Cells | 244188 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12038144 |
Overview of EP2AGX260EF29I3N – Arria II GX Field Programmable Gate Array (FPGA) IC
The EP2AGX260EF29I3N is an Arria II GX family FPGA in an industrial-grade, surface-mount FCBGA package. It combines a large logic fabric with on-chip embedded memory and extensive I/O to support complex, high-density digital designs.
This device is suited to industrial and embedded applications that require substantial programmable logic (244,188 logic elements), approximately 12.0 Mbits of embedded memory, and up to 372 I/O signals, while operating across an extended temperature range and core supply window.
Key Features
- Large Logic Capacity 244,188 logic elements provide significant resources for complex logic, control functions, and custom accelerators.
- Embedded Memory Approximately 12.0 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-throughput designs.
- I/O Density Up to 372 I/O pins accommodate wide parallel interfaces and multiple peripheral connections in a single device.
- Package and Mounting 780-BBGA (FCBGA) package with supplier package 780-FBGA (29×29) in a surface-mount form factor for compact board-level integration.
- Power Supply Range Core voltage supply range of 870 mV to 930 mV to match system power rails and core requirements.
- Industrial Grade and Temperature Range Rated for industrial use with operating temperature from –40°C to 100°C for extended-environment deployments.
- Design and Timing Resources Device handbook references include electrical characteristics, transceiver performance specifications, and I/O timing information for system-level planning and validation.
- RoHS Compliant Conforms to RoHS requirements for lead-free assembly and regulatory compliance.
Typical Applications
- Industrial Control Logic density and extended temperature range support machine control, motor drive interfaces, and factory automation systems requiring durable FPGA processing.
- High‑Density Digital Systems Large logic and memory resources enable implementation of complex state machines, protocol bridges, and custom accelerators for embedded computing.
- High‑Speed Serial and Connectivity Arria II GX device family documentation includes transceiver performance and I/O timing details, making this FPGA suitable for designs requiring robust serial connectivity and interface management.
- Video and Signal Processing Significant on-chip RAM and logic resources support buffering, frame processing, and data-path operations in imaging and signal-processing applications.
Unique Advantages
- Substantial Logic and Memory in One Device: The combination of 244,188 logic elements and ~12.0 Mbits of embedded RAM reduces the need for external components and simplifies board design.
- High I/O Count for System Integration: 372 available I/O pins let you consolidate multiple interfaces and peripherals on a single FPGA, lowering BOM complexity.
- Industrial Reliability: Industrial-grade rating and –40°C to 100°C operating range support deployment in temperature-challenging environments.
- Compact FCBGA Packaging: 780-BBGA / 780-FBGA (29×29) package provides a high-density, surface-mount solution for space-constrained PCBs.
- Predictable Power Envelope: Defined core supply range (870 mV–930 mV) enables accurate power budgeting and thermal planning in system designs.
- Standards-Ready Documentation: Device handbook content includes electrical characteristics, transceiver performance, and I/O timing to aid validation and integration efforts.
Why Choose EP2AGX260EF29I3N?
EP2AGX260EF29I3N delivers a balanced platform of logic capacity, embedded memory, and high I/O count in an industrial-grade Arria II GX FPGA package. Its combination of resources and documented device characteristics makes it suitable for engineers building compact, reliable systems that require significant programmable logic and on-chip storage.
This part is a practical choice for development teams and OEMs focused on industrial and embedded applications that need scalability, robustness, and clear electrical and timing guidance from device documentation.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for EP2AGX260EF29I3N. Our team can provide lead-time details and assist with qualification requirements for your project needs.

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