EP2AGX260EF29I3N

The EP2AGX260EF29I3N is an Arria II GX family FPGA in an industrial-grade, surface-mount FCBGA package. It combines a large logic fabric with on-chip embedded memory and extensive I/O to support complex, high-density digital designs.

This device is suited to industrial and embedded applications that require substantial programmable logic (244,188 logic elements), approximately 12.0 Mbits of embedded memory, and up to 372 I/O signals, while operating across an extended temperature range and core supply window.

Key Features

• Large Logic Capacity  244,188 logic elements provide significant resources for complex logic, control functions, and custom accelerators.
• Embedded Memory  Approximately 12.0 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Density  Up to 372 I/O pins accommodate wide parallel interfaces and multiple peripheral connections in a single device.
• Package and Mounting  780-BBGA (FCBGA) package with supplier package 780-FBGA (29×29) in a surface-mount form factor for compact board-level integration.
• Power Supply Range  Core voltage supply range of 870 mV to 930 mV to match system power rails and core requirements.
• Industrial Grade and Temperature Range  Rated for industrial use with operating temperature from –40°C to 100°C for extended-environment deployments.
• Design and Timing Resources  Device handbook references include electrical characteristics, transceiver performance specifications, and I/O timing information for system-level planning and validation.
• RoHS Compliant  Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Control  Logic density and extended temperature range support machine control, motor drive interfaces, and factory automation systems requiring durable FPGA processing.
• High‑Density Digital Systems  Large logic and memory resources enable implementation of complex state machines, protocol bridges, and custom accelerators for embedded computing.
• High‑Speed Serial and Connectivity  Arria II GX device family documentation includes transceiver performance and I/O timing details, making this FPGA suitable for designs requiring robust serial connectivity and interface management.
• Video and Signal Processing  Significant on-chip RAM and logic resources support buffering, frame processing, and data-path operations in imaging and signal-processing applications.

Unique Advantages

• Substantial Logic and Memory in One Device: The combination of 244,188 logic elements and ~12.0 Mbits of embedded RAM reduces the need for external components and simplifies board design.
• High I/O Count for System Integration: 372 available I/O pins let you consolidate multiple interfaces and peripherals on a single FPGA, lowering BOM complexity.
• Industrial Reliability: Industrial-grade rating and –40°C to 100°C operating range support deployment in temperature-challenging environments.
• Compact FCBGA Packaging: 780-BBGA / 780-FBGA (29×29) package provides a high-density, surface-mount solution for space-constrained PCBs.
• Predictable Power Envelope: Defined core supply range (870 mV–930 mV) enables accurate power budgeting and thermal planning in system designs.
• Standards-Ready Documentation: Device handbook content includes electrical characteristics, transceiver performance, and I/O timing to aid validation and integration efforts.

Why Choose EP2AGX260EF29I3N?

EP2AGX260EF29I3N delivers a balanced platform of logic capacity, embedded memory, and high I/O count in an industrial-grade Arria II GX FPGA package. Its combination of resources and documented device characteristics makes it suitable for engineers building compact, reliable systems that require significant programmable logic and on-chip storage.

This part is a practical choice for development teams and OEMs focused on industrial and embedded applications that need scalability, robustness, and clear electrical and timing guidance from device documentation.

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