EP2AGX260FF35C5N

The EP2AGX260FF35C5N is an Intel Arria II GX field programmable gate array (FPGA) in a 1152-BBGA FCBGA package. It delivers a large programmable fabric and high I/O density for complex, board-level digital designs in commercial applications.

With 244,188 logic elements and substantial on-chip RAM, this device targets designs that require significant logic capacity, dense peripheral connectivity, and a compact surface-mount package within a commercial temperature range.

Key Features

• Core Capacity — 244,188 logic elements for implementing complex digital logic and custom computing functions.
• Embedded Memory — approximately 12.04 Mbits of on-chip RAM to support large data buffers and state storage without immediate reliance on external memory.
• I/O Density — 612 general-purpose I/Os to support multiple peripherals, buses, and high-pin-count interfaces.
• Power Supply — core supply range specified at 870 mV to 930 mV.
• Package & Mounting — 1152-BBGA (1152-FBGA, 35 × 35 mm) in an FCBGA form factor with surface-mount mounting.
• Operating Temperature & Grade — commercial grade device rated for 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — implement large logic engines and custom accelerators using 244,188 logic elements and on-chip RAM.
• Dense system interfacing — 612 I/Os enable connection to multiple peripherals, parallel buses, and board-level interfaces.
• Board-level integration and prototyping — surface-mount 1152-BBGA package supports compact PCB designs within commercial temperature limits.

Unique Advantages

• Large programmable fabric: Capacity for complex designs with 244,188 logic elements.
• Significant on-chip memory: Approximately 12.04 Mbits of embedded RAM to reduce external memory dependencies.
• Extensive I/O count: 612 I/Os for flexible peripheral and bus connectivity.
• Compact FCBGA package: 1152-BBGA (35 × 35 mm) surface-mount package suitable for space-constrained boards.
• Commercial operating range: Rated 0 °C to 85 °C for standard commercial deployments.
• Regulatory compliance: RoHS compliant and manufactured by Intel.

Why Choose EP2AGX260FF35C5N?

The EP2AGX260FF35C5N delivers a combination of high logic density, ample embedded memory, and broad I/O resources in a single commercial-grade FPGA package. It is suited to systems that require extensive on-chip logic and connectivity while meeting standard commercial temperature and manufacturing requirements.

Designers and OEMs seeking a high-capacity Arria II GX device for complex digital designs can leverage this part’s large logic element count, substantial on-chip RAM, and high pin count to consolidate functionality and simplify board-level integration.

Request a quote or submit a product inquiry to receive pricing and availability information for the EP2AGX260FF35C5N.